MEMS芯片器件用非蒸散型吸气剂的研究状况  

Research Situation of Non-Evaporable Getter Films for MEMS

作　　者：苏童 艾永昌 黄水明 徐凯 侯雪玲[1] 周超[2] 刘兴光 SU Tong;AI Yongchang;HUANG Shuiming;XU Kai;HOU Xueling;ZHOU Chao;LIU Xingguang(School of Materials Science and Engineering,Shanghai University,Shanghai 200072;Science and technology on vacuum technology and physics laboratory,Lanzhou institute of physics,Lanzhou 730000)

机构地区：[1]上海大学材料科学与工程学院,上海200072 [2]真空技术与物理重点实验室兰州空间技术物理研究所,兰州730000

出　　处：《真空科学与技术学报》2021年第7期674-682,共9页Chinese Journal of Vacuum Science and Technology

摘　　要：随着"物联网"时代的来临及智能芯片推出,在全世界范围内掀起了MEMS(Micro-Electro-Mechanical System)芯片器件发展浪潮。高端的MEMS芯片器件需要在其内部安置吸气剂以维持器件的真空度,它是保证芯片器件长寿命和高灵敏性的关键材料,对于芯片器件的安全性具有重要意义。本文分别从薄膜吸气剂和块体吸气剂两方面,介绍了非蒸散型吸气剂的发展过程,分析了国内外Zr基、Ti基合金非蒸散型吸气剂的合金化改性、激活工艺、吸气性能、制备工艺等方面研究进程,如薄膜吸气剂主要通过物理气相沉积法(Physical Vapor Deposition,PVD),调整工艺参数,形成有序疏松多孔状纳米晶结构组织,以达到高吸气量、低激活温度的目的,工艺侧重提高薄膜的孔隙率和比表面积;块体吸气剂主要通过粉末冶金烧结而成,吸气后材料表层逐渐粉化暴露出新鲜吸气表面,达到不断吸气的目的。总结了目前薄膜吸气剂和块体吸气剂存在的问题,如:块体吸气剂在应用过程中会发生脱粉现象,严重影响MEMS器件的寿命和灵敏性,目前学者对影响块体吸气剂掉粉问题的前期工艺研究比较少,急需进行改善。最后,本文对非蒸散型吸气剂未来的研究方向进行了展望。With the advent of the "Internet of things" and the demand for smart chips launched by the "Internet of things",MEMS(Micro-Electro-Mechanical System)devices have been developing rapidly all over the world.Up-market MEMS devices need to install getter inside. It is the key material to maintain the vacuum degree,long life and high sensitivity of the MEMS devices,which is of great significance. In this paper,the development process of non-evaporable getter is introduced from two different forms of getter:film and block. The preparation process,alloying modification,activation temperature and getter performance of Zr based and Ti based getter at home and abroad are analyzed. Film getter is mainly produced by physical vapor deposition(PVD),we adjust the process parameters to form orderly porous nano crystal structure in its interior,so as to achieve the purpose of high suction capacity and low activation temperature. The process focuses on improving the porosity and specific surface area of the film. The bulk getter is mainly made by powder metallurgy sintering. After suction,the alloy gradually begins to pulverize and expose the fresh suction surface,so as to achieve continuous suction. At present,It needs to be improved that there is little research on the early stage technology that affects the powder removal of block getter.Finally,the future research direction of non-evaporable getters is prospected.

关 键 词：MEMS芯片器件 非蒸散型吸气剂 制备工艺 激活温度 吸气性能 

分 类 号：TG13[一般工业技术—材料科学与工程]