关于无氰化学镀金技术的发展研究  

Research on the Development of Cyanide-Free Electroless Gold Plating Technology

作　　者：杨义华 文明立 Yang Yi-hua;Wen Ming-li(Ji’an Hotchain Technology Co.,Ltd.,Ji’an 343900,Jiangxi Province,China)

机构地区：[1]吉安宏达秋科技有限公司,江西吉安343900

出　　处：《科学与信息化》2021年第22期117-119,共3页Technology and Information

摘　　要：无氰化学镀金技术的优势包括操作安全性高、工艺操作步骤简单、与环境友好,可在非金属材料表面进行施镀,具有均匀的镀层厚度等性能,已经广泛应用于印刷线路板等微电子行业中。目前常见的化学镀金体系是以亚硫酸盐与硫代盐酸盐为复合配位剂;但依然存在镀液稳定性差的问题,因此目前依然无法完全取代氰化物镀金;但未来发展趋势是通过调整传统化学镀金工艺或加入特殊化学镀金工艺还原剂与添加剂,以减轻镀金时的过腐蚀问题。本文立足于“镀金技术发展”视阈下,结合当下常用与热议的“无氰化学镀金技术”进行叙述,表达自身认识。本文从化学镀金的原理、化学镀金液的组成及各种常见的镀液入手进行介绍,望为读者在相关领域内的研究与学习提供一些帮助。The advantages of cyanide-free electroless gold plating technology include high operational safety,simple operation process steps,and harmony with environment.It can be plated on the surface of non-metallic materials and has properties such as uniform plating thickness.It has been widely used in microelectronics such as printed circuit boards.The current common electroless gold plating system uses sulfite and thiosulfate as the composite complexing agent;but there is still the problem of poor stability of electroplating solution,so it is still unable to completely replace cyanide gold plating at present;however,the future development trend is to alleviate the over-corrosion problem during gold plating through the adjustment of traditional electroless gold plating process or addition of special electroless gold plating process reducing agent and additives.This article focuses on the“gold plating technology development”,combines with the current commonly used and hotly discussed“cyanide-free electroless gold plating technology”for discussion,and express the authors’understanding.This article introduces the principle of electroless gold plating,the composition of electroless gold plating solution and various common plating solutions,and hopes to provide readers with some help in the research and study of related fields.

关 键 词：无氰化学镀金技术 镀金 化学镀金 无氰 

分 类 号：TQ1[化学工程]