激光直写柔性电路的研究进展  

Research progress in laser direct writing of flexible circuit

作　　者：申超 翁沛希 王子杰 武文杰 谢小柱[1,2,3] SHEN Chao;WENG PeiXi;WANG ZiJie;WU WenJie;XIE XiaoZhu(Laser Micro/Nano Processing Lab,School of Electromechanical Engineering,Guangdong University of Technology,Guangzhou 510006,China;State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment,School of Electromechanical Engineering,Guangdong University of Technology,Guangzhou 510006,China;Department of Experiment Teaching,Guangdong University of Technology,Guangzhou 510006,China)

机构地区：[1]广东工业大学机电工程学院激光微纳加工研究中心,广州510006 [2]广东工业大学机电工程学院,省部共建精密电子制造技术与装备国家重点实验室,广州510006 [3]广东工业大学实验教学部,广州510006

出　　处：《中国科学：物理学、力学、天文学》2021年第8期32-47,共16页Scientia Sinica Physica,Mechanica & Astronomica

基　　金：国家自然科学基金(编号:52075103,51805093);国家重点研发计划(编号:2018YFB1107700)资助项目。

摘　　要：目前柔性电子行业正处于一个重要的转型期,各种外形新颖和功能丰富的柔性电子产品不断涌现,从有限的柔性到具有形状适应性及延展性的柔性电子设备.这极大地刺激了人们对柔性电子设备的需求,在更大幅面基板上以更低的成本开发出特征尺寸更小,以及性能更好的柔性电路制造技术备受关注.在各种技术中,激光直写技术已经被证明是一种高效灵活且能够大面积生产柔性电子电路的制造方法.激光直写作为一种非光刻、非真空、在线式加工技术已经受到了越来越多的关注.其可以应用于包括热敏柔性衬底在内的各种衬底的电路电极的制造中,在生产柔性电子设备、柔性储能设备、传感器以及可穿戴电子设备等领域有着巨大的应用前景.本文对激光直写柔性电路(Laser Direct Writing of Flexible Circuit, LDWFC)技术在柔性电路制造中的最新发展进行了总结,重点介绍了激光直写技术在柔性电路制造中所适用的导电油墨材料种类和特点.从激光烧结技术、激光还原技术、激光诱导改性技术、激光辅助电路制造技术4个方面详细介绍了LDWFC加工技术.此外,本文还介绍了LDWFC在柔性储能器件、柔性传感器以及柔性显示器中的应用,并对LDWFC技术在柔性电路制造中的发展进行了展望.At present, the flexible electronics industry is in an important transitional period, and various flexible electronic devices with novel properties and enhanced functions are constantly emerging, from limited flexibility to flexible electronic devices with shape adaptability and ductility. This has greatly stimulated demand for flexible electronic devices. The development of manufacturing technologies for flexible circuits with smaller feature sizes and better performance on larger-format substrates at lower costs has attracted increasing attention. Among various technologies, laser direct writing has proven to be an efficient and flexible manufacturing method that can produce large-area flexible electronic circuits.As a nonlithographic, nonvacuum, and online processing technology, laser direct writing has received considerable attention. It can be employed in the production of circuit electrodes of various substrates, including heat-sensitive flexible substrates, and it has huge application prospects in the production of flexible electronic and energy storage devices,sensors, and wearable electronic devices. On this basis, this article summarizes the latest development in the laser direct writing of flexible circuit(LDWFC) technology for manufacturing flexible circuits. It focuses on the material types and characteristics of the conductive inks suitable for LDWFC in the production of flexible circuits. The LDWFC processing technology is introduced in detail from four aspects: laser sintering technology, laser reduction technology, laser-induced modification technology, and laser auxiliary circuit manufacturing technology. In addition, the application of LDWFC in flexible energy storage devices, tenderness sensors, and flexible displays is introduced, and the development prospects of LDWFC technology in flexible circuit manufacturing are highlighted.

关 键 词：激光直写 柔性电路 导电油墨 柔性衬底 

分 类 号：TN710[电子电信—电路与系统] TN249