基于焊接工艺优化的混装BGA焊点孔洞研究  

Research on Void of Mixed BGA Solder Joints Based on Welding Process Optimization

作　　者：韩立帅 王玉忠 HAN Lishuai;WANG Yuzhong(CEPREI,Guangzhou 511370,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370

出　　处：《电子产品可靠性与环境试验》2021年第4期62-67,共6页Electronic Product Reliability and Environmental Testing

摘　　要：研究了不同焊膏(阿尔法3号粉OM5100、铟泰锡膏RMA-3号粉Lot:PSS019452和Alpha-FryTM型号Lot:80529053)和不同焊接工艺曲线参数(不同链速、不同温度)对BGA焊点中孔洞尺寸和焊料组织均匀性影响。通过对比分析得到以下结论:采用Lot:PSS019452和Lot:80529053锡膏进行焊接后BGA焊点中空洞分布得到明显的改善,并且空洞体积也较小;混装焊接工艺曲线参数中链速设置为70~90 cm/min,温度设置为260~270℃时,BGA焊点中孔洞较小,焊点组织比较均匀。The effects of different welding paste(Alpha No.3 powder OM5100,Indium Tin Paste RMA-3 No.Powder Lot:PSS019452 and Alpha-Fry TM Model Lot:80529053)and different welding process curve parameters(different chain speeds and different temperatures)on the hole size and tissue uniformity of solder in the BGA welding point are studied.And the following conclusions are obtained by comparative analysis:the void distribution in the BGA solder joint is significantly improved and the void volume is small after welding with LOT:PSS019452 and LOT:80529053 solder paste,and when the chain speed is set to 70~90 cm/min,temperature is set to 260〜270℃during mixed assembly welding process,the hole in the BGA welding point is small and the welding point organization is relatively uniform.

关 键 词：BGA焊点 孔洞控制 混装焊接工艺 焊接工艺优化 

分 类 号：TN405[电子电信—微电子学与固体电子学]