Wetting of Laser Textured Cu Surface by Ethylene Glycol and Sn  

作　　者：Kaibin Xie Yujie Ge Qiaoli Lin 

机构地区：[1]State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metal,Lanzhou University of Technology,Lanzhou,730050,China

出　　处：《Journal of Metallic Material Research》2021年第1期6-11,共6页金属材料研究（英文）

基　　金：supported by National Natural Science Foundation of China(Nos.51665031).

摘　　要：The effect of microcosmic morphologies of textured Cu surface by nanosecond laser on the inert wetting and reactive wetting,i.e.,ethylene glycol/copper and tin/copper wetting systems,was studied by using modified sessile drop methods.To create different surface roughness,the microcosmic morphologies with different spacing of grooves were constructed by nanosecond laser.The results showed that the inert wetting(ethylene glycol/copper)was consistent with Wenzel model,while the reactive wetting results deviated from the model.In Sn/Cu reactive wetting system,the interfacial evolution in the early stage and the pinning of triple line by the precipitated η-Cu_(6)Sn_(5) caused the rougher surface and the worse final wettability.When the scale of artificial roughness exceeded the roughness that was caused by interfacial reaction after reaching the quasi-equilibrium state at interface,the final wettability could be improved.

关 键 词：WETTABILITY Nanosecond laser Roughness SOLDERING TEXTURING 

分 类 号：O64[理学—物理化学]