压电喷墨3D打印射频多层电路工艺  

3D Printing with Piezoelectric Inkjet for RF Multilayer Circuit

作　　者：阎德劲[1] YAN Dejin(The 10th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第十研究所,四川成都610036

出　　处：《电子工艺技术》2021年第5期271-273,306,共4页Electronics Process Technology

基　　金：科工局技术基础项目(JCKY2018110C060)。

摘　　要：针对传统射频电路板加工周期长、工艺流程复杂等问题,创新性地采用压电喷墨3D打印技术打印射频天线多层电路板,开展了打印材料、打印参数及打印工艺对成型效果的研究。经测试,打印的样件在外形尺寸、打印线路精度,以及驻波损耗等电性能方面均能达到设计指标要求。论证了压电喷墨3D打印技术可有效用于射频多层电路的快速制造和快速验证,为压电喷墨3D打印射频多层电路的制造提供了良好的基础,可加速实现射频多层电路的绿色制造、集成制造和快速制造,并缩短了研发周期。In view of the long processing cycle and complicated process of traditional radio frequency(RF)circuit boards,3D printing with piezoelectric inkjet is innovatively used to print RF antenna multilayer circuit boards,and the effects of printing materials,printing parameters and printing process on forming effect are studied.After testing,the printed samples meet the design requirements in terms of shape size,printed circuit accuracy,and electrical properties such as standing wave loss.It is demonstrated that the 3D printing with piezoelectric inkjet technology can be effectively used for the rapid manufacturing and rapid verification of RF multilayer circuits,which provides a good foundation for the manufacturing of RF multilayer circuits by 3D printing,can accelerate the realization of green manufacturing,integrated manufacturing,and rapid manufacturing of RF multilayer circuits,and shorten the R&D cycle.

关 键 词：射频电路板 压电喷墨 3D打印 

分 类 号：TN605[电子电信—电路与系统]