微系统Interposer测试技术与发展趋势  

Research status and development trends of Interposer test technology on micro-system

作　　者：秦贺 武昊男 魏晓飞 李晓龙 冯长磊 QIN He;WU Haonan;WEI Xiaofei;LI Xiaolong;FENG Changlei(Beijing Microelectronics Technology Institute,Beijing 100076,China)

机构地区：[1]北京微电子技术研究所,北京100076

出　　处：《遥测遥控》2021年第5期63-69,共7页Journal of Telemetry,Tracking and Command

摘　　要：随着微系统技术向三维立体集成不断发展,Interposer技术逐渐成为关注的焦点,是未来电子系统小型化和多功能化的重要技术途径,具有广阔的应用市场和发展前景。关于Interposer的测试技术研究也提上发展日程。对目前Interposer测试技术的研究现状和发展趋势进行了综述,重点总结了研究机构在Interposer测试技术领域的研究现状,并对技术发展趋势做了简单展望。With the development of microsystem technology towards 3D integration,Interposer technology has become the focus of research.It is an important technology roadmap of miniaturization and multi-function of electronic systems in future,with wide market in application and prospective development.Research on the Interposer test technology is also put on the development agenda.This article gives a brief description of current status and development trend of Interposer test technology,especially focusing on the research and development by institutes.Furthermore,there is brief prospective on Interposer test technology development.

关 键 词：微系统 Interposer 测试 TSV RDL 

分 类 号：TN407[电子电信—微电子学与固体电子学]