新型星载信息处理与控制微系统设计  

Architecture design of new spaceborne information processing and control microsystem

作　　者：刘全威[1] 张崎[1] 许振龙 LIU Quanwei;ZHANG Qi;XU Zhenlong(Anhui Province Key Laboratory of Microsystem,the 43rd Research Institute of CETC,Hefei 230088,China;Shandong Aerospace Electronic Technology Institute,Yantai 264000,China)

机构地区：[1]中国电子科技集团公司第四十三研究所微系统安徽省重点实验室,合肥230088 [2]山东航天电子技术研究所,烟台264000

出　　处：《遥测遥控》2021年第5期95-101,共7页Journal of Telemetry,Tracking and Command

摘　　要：研究星载信息处理与控制系统利用微系统技术解决空间装备小型化、高可靠、高性能与高效热管理的问题。首先介绍基于新型星载器件的数据处理与控制系统架构,然后通过以晶圆级处理、芯片堆叠、微凸点制备与微组装等为核心的三维微纳集成技术,将系统核心硬件部分缩小为原尺寸的20%,从而大幅减少体积、尺寸和重量。利用高导热封装材料,解决空间电子系统高效热管理问题,提出一种新型星载信息处理与控制微系统设计和实现的通用解决方案,并通过半实物仿真验证了在小型化、高可靠、高性能与高效热管理方面的优势。This paper focuses on spaceborne information processing and control system based on microsystem technology that used to reach the goals of miniaturization,high reliability,high performance and efficient thermal management of space equipment.Firstly,the architecture of data processing and control system based on the new spaceborne devices are introduced.Then,the 3D micro-nano integration technology,which is based on wafer level processing,chip stacking,micro bump preparation and micro assembly,is used to reduce the size of the core hardware of the system to 20%of the original size,thus greatly reducing the volume,size and weight.In this paper,high thermal conductivity packaging materials are used to reach the goals of efficient thermal management of spaceborne electronic system.A new general solution for the design and implementation of spaceborne information processing and control microsystem is proposed.The advantages of this solution in miniaturization,high reliability,high performance and efficient thermal management are verified by hardware in the loop Demo system.

关 键 词：星载 微系统 三维集成 高效热管理 

分 类 号：TN452[电子电信—微电子学与固体电子学]