基于电容补偿的键合金丝互连微波特性研究  

Research on the Microwave Characteristic of Bonding Wire Based on Capacitance Compensation

作　　者：王磊 王爱华 WANG Lei;WANG Aihua(No.8511 Research Institute of CASIC,Nanjing 210007,China)

机构地区：[1]中国航天科工集团8511研究所,南京210007

出　　处：《电子与封装》2021年第9期47-50,共4页Electronics & Packaging

摘　　要：对键合金丝互连线的电磁特性进行建模仿真分析,并根据键合互连线的等效电路模型,设计了容性补偿枝节来改善金丝互连的微波信号传输特性。仿真结果表明,设计的金丝键合容性补偿枝节可以显著改善电路传输特性。在Ka波段,容性补偿枝节电路的插入损耗比补偿前减小了约0.15 dB;电压驻波比在30~40 GHz范围内改善了约0.4。The electromagnetic characteristics of wire bonding is modeled and analyzed,and according to the equivalent circuit model of bonding interconnect,the capacitance compensation structure is designed to improve the microwave transmission characteristics of bonding interconnect.The simulation results show that the wire bonding capacitance compensation structure can obviously improve the circuit transmission characteristics.In the Ka band,the insertion loss is minimized about 0.15 dB compared to the gold wire interconnecting without capacitance compensation;VSWR is improved(30~40 GHz)by about 0.4.

关 键 词：电容补偿 金丝互连 微波特性 KA波段 

分 类 号：TN305.94[电子电信—物理电子学]