Smart-microstructures of composites for electrical contacts with frameless packing of Cr and W in copper  

铜中无骨架填充Cr和W电触头复合材料的智能显微组织

作　　者：L.E.BODROVA S.Yu.MELCHAKOV A.B.SHUBIN E.Yu.GOYDA 

机构地区：[1]Institute of Metallurgy of the Ural Branch of the Russian Academy of Sciences,620016,Ekaterinburg,101,Amundsen Street,Russian Federation

出　　处：《Transactions of Nonferrous Metals Society of China》2021年第9期2773-2786,共14页中国有色金属学报（英文版）

摘　　要：W_(45)Cu_(55),Cr_(65)Cu_(35),and Cr_(32)W_(14)Cu_(54)alloys were obtained in order to study the mechanism of“smart response”of the structure of these alloys when using them as arc-resistant circuit-breakers.These alloys differ from industrial ones with frameless packing of Cr and W phases in the copper matrix.The alloy production method is based on the infiltration of copper melt into a mixture of non-compacted Cr and W powders under vibration exposure(80 Hz).The research results show an increase in the arc resistance of contacts when changing from“frame”packing of W to“frameless,”as well as the decisive role of Cr in the processes of self-dispersion of arc-resistant phases and passivation of W and Cu.Based on the obtained results,conclusions are drawn about the advantage of frameless packing of arc-resistant phases in copper and the reasons for the“smart behavior”of the structure of Cr-containing contacts in response to functional loads in the presence of oxygen and an inert atmosphere.为了研究抗电弧断路器合金显微组织的智能响应机制,制备W_(45)Cu_(55)、Cr_(65)Cu_(35)和Cr_(32)W_(14)Cu_(54)合金。与工业合金不同,这些合金中Cr和W相是无骨架填充到铜基体中。其制备方法是在振动(80 Hz)下,将铜熔体渗透到未压实的Cr和W混合粉末中。结果显示,当W由“骨架”填充变为“无骨架”填充后,触头的抗弧性能有所提高,Cr对抗弧相的自扩散和W、Cu钝化过程起决定性作用。基于所得结果,总结铜中无骨架填充抗电弧相的优点,以及含Cr触头显微组织在含氧和惰性气氛下对功能载荷响应时“智能行为”的原因。

关 键 词：Cr−W−Cu electro-contact materials INFILTRATION smart-structure self-dispersion 

分 类 号：TB331[一般工业技术—材料科学与工程] TM561[电气工程—电器]