活性剂对SnAgCu系无铅焊锡膏储存稳定性的影响  

Effect of Activators on Storage Stability of Sn AgCu Lead-Free Solder Paste

作　　者：孙杰 赵麦群[1] 何宇航 李鹏宇 袁昕 SUN Jie;ZHAO Maiqun;HE Yuhang;LI Pengyu;YUAN Xin(School of Materials Science and Engineering,Xi'an University of Technology,Xi'an 710048,China)

机构地区：[1]西安理工大学材料科学与工程学院,陕西西安710048

出　　处：《热加工工艺》2021年第17期41-45,共5页Hot Working Technology

基　　金：陕西省教育厅重点实验室科研计划项目资助(No.14JS069)。

摘　　要：储存稳定性已成为国产无铅锡膏的一个短板。采用动电位极化法研究了助焊剂体系中由不同种类活性剂和不同种类溶剂组成的腐蚀介质对表面有氧化层的锡块的腐蚀行为,并通过回流焊接实验研究了活性剂对Sn3Ag0.5Cu焊锡膏储存稳定性的影响。结果表明:焊锡膏的稳定储存时间取决于活性剂对焊锡材料的腐蚀速率,腐蚀速率越小其稳定储存时间越长。用以己二酸为活性剂、A醚为溶剂组成的助焊剂所配制的焊锡膏具有优异的储存稳定性,在室温下可稳定储存120 d,在40℃下可稳定储存36 d且铺展率均达到82%以上。The storage stability has become a shortcoming board for domestic lead-free solder pastes. Dynamic potential polarization method was employed to investigate the corrosion behavior of tin block with an oxide layer on the surface corroded by the corrosion medium composed of different activators and solvents in flux system. And the effect of activators on the storage stability of the Sn3Ag0.5Cu solder paste was studied by reflow soldering. The results show that the stable storage time of solder paste depends on the corrosion rate of activators on solder material. The smaller the corrosion rate, the longer the stable storage time. Solder paste using adipic acid as activator and A-ether as solvent displays excellent storage stability. It can be stored stably for 120 days at room temperature, and up to 36 days at 40℃and the spreading rate is all over 82%.

关 键 词：无铅焊膏 储存稳定性 腐蚀速率 活性剂 溶剂 

分 类 号：TG425[金属学及工艺—焊接]