宽带横电磁波小室设计与测试应用  

Design and test application of broadband TEM cell

作　　者：袁钟柱 万发雨[1] YUAN Zhongzhu;WAN Fayu(School of Electronics&Information Engineering,Nanjing University of Information Science&Technology,Nanjing 210044)

机构地区：[1]南京信息工程大学电子与信息工程学院,南京210044

出　　处：《南京信息工程大学学报（自然科学版）》2021年第4期437-443,共7页Journal of Nanjing University of Information Science & Technology（Natural Science Edition）

基　　金：国家自然科学基金(61971230)。

摘　　要：本文提出了一种符合IEC标准的横电磁波(TEM)小室,用于集成电路的电磁兼容测试.该TEM小室可在0~3 GHz内实现反射系数小于-12 dB,传输系数优于-2.5 dB.本文采用三维电磁仿真软件(Computer Simulation Technology,CST)对TEM小室的阻抗、S参数、场均匀性以及被测物(EUT)对场的影响进行仿真设计,加工实测并与商业产品进行了对比.最后,参考了IEC标准制作了电磁兼容测试板,并以TEM小室对集成电路(IC)芯片的辐射发射进行测量,分析测量结果有助于改善集成电路电磁兼容性.This paper proposes a Transverse Electric and Magnetic field(TEM)cell that meets the IEC standard to test the electromagnetic compatibility of Integrated Circuits(IC).The TEM cell is featured with less than-12 dB of reflection coefficient and better than-2.5 dB of transmission coefficient in frequency range of 0-3 GHz.The Computer Simulation Technology(CST)software is used to simulate the impedance,S-parameters,field uniformity and the influence of Equipment Under Test(EUT)on the field of the TEM cell,moreover,the TEM cell is fabricated and compared with commercial TEM cell.In addition,an electromagnetic compatibility test board is made according to the IEC standard,which is then used to measure the IC radiation emission with the TEM cell.The analysis of the measurement results indicates some aspects to improve the electromagnetic compatibility of the integrated circuits.

关 键 词：TEM小室 S参数 场均匀性 IC芯片 电磁兼容 

分 类 号：TN03[电子电信—物理电子学] TM937[电气工程—电力电子与电力传动]