蚀刻金属薄膜法制作埋置电阻印制板的影响因素研究  

Study on influence factors of embedded resistance PCB fabricated by etching metal-film

作　　者：白亚旭 吴永恒 王俊 Bai Yayu;Wu Yongheng;Wang Jun

机构地区：[1]深圳市景旺电子股份有限公司PCB技术研发中心,广东深圳518102 [2]深圳市景旺电子股份有限公司,广东深圳518102

出　　处：《印制电路信息》2021年第10期53-57,共5页Printed Circuit Information

摘　　要：通过对不同埋阻材料的分析对比和试验测试,选择了一款与现有PCB生产工艺流程匹配度较好,且无需增加其他专用设备和其他特殊工艺流程便可加工的埋阻材料。文章介绍了制作高频高速埋置电阻印制板的工艺流程选择和过程加工难点管控。Through the analysis,comparison and test of different Embedded-resistance materials,a kind of Embedded-resistance material with good matching with the current PCB production process is selected,which can be produced without adding other special equipment and other special processes.This paper introduces the production process of High-frequency and High-speed Embedded-resistance PCB,and the control of processing difficulties.The test results show that the tolerance of Embedded Resistance is closely related to the product design and production process.

关 键 词：蚀刻 金属薄膜 镍-磷合金 镍-铬合金 埋置电阻 

分 类 号：TN41[电子电信—微电子学与固体电子学]