耐高温瞬时液相连接无铅钎焊接头的时效稳定性  

High temperature resistant aging stability of lead-free solder joints by TLP bonding

作　　者：李正兵 王德 胡德安[1] 陈益平[1] 程东海[1] 郭义乐 何凯 黄硕 李晓军 LI Zheng-bing;WANG De;HU De-an;CHEN Yi-ping;CHENG Dong-hai;GUO Yi-le;HE Kai;HUANG Shuo;LI Xiao-jun(School of Aeronautical Manufacturing Engineering,Nanchang Hangkong University,Nanchang 330063,China;National Institute of Nanotechnology and Innovation,Guangzhou 510770,China)

机构地区：[1]南昌航空大学航空制造工程学院,南昌330063 [2]国家纳米科技创新研究院,广州510770

出　　处：《材料工程》2021年第10期82-88,共7页Journal of Materials Engineering

基　　金：国家自然科学基金项目(51865034)。

摘　　要：通过瞬时液相(TLP)连接的互连工艺,采用Sn4.7Ag1.7Cu+Ag复合钎料,制备Sn4.7Ag1.7Cu+Ag复合钎料/Cu接头。采用SEM观察恒温时效过程中接头的组织,结合EDS对比不同工艺下试样接头组织,并对接头性能进行对比分析。结果表明:随着Ag颗粒含量的增加,Sn4.7Ag1.7Cu+Ag/Cu接头耐高温(300℃)服役性能随之提高;Ag含量为25%(质量分数)时接头在高于基体钎料熔点(217℃)83℃下服役15天未断裂,且抗拉强度为25.74 MPa,达到了低温焊接、高温服役的目的;与Sn4.7Ag1.7Cu/Cu接头相比,随着时效的进行,Sn4.7Ag1.7Cu+Ag复合钎料/Cu接头焊缝组织中残余的Ag颗粒不断溶解,并在接头界面附近产生大量Ag_(3)Sn化合物,而大量的块状Ag_(3)Sn化合物可以有效抑制焊缝中Sn元素向Cu基板扩散,达到抑制Cu_(3)Sn层生长的目的;在200℃服役温度条件下,随着时效的进行,Sn4.7Ag1.7Cu+Ag复合钎料/Cu接头力学性能先下降后上升,然后再下降并趋于稳定,且力学性能稳定性比Sn4.7Ag1.7Cu/Cu接头要好。The Sn4.7Ag1.7Cu+Ag composite solder/Cu joint was prepared with Sn4.7Ag1.7Cu+Ag composite solder by transient liquid phase(TLP)bonding process.The microstructure of the joints under constant temperature aging was observed by SEM,combined with EDS,the microstructure and properties of the joints under different processes were compared and analyzed.The results show that the service performance of Sn4.7Ag1.7Cu+Ag/Cu joint at high temperature(300℃)is improved with the increase of Ag particle content.When the content of Ag is 25%(mass fraction),the joint does not break after 15 days of service at 83℃higher than the melting point(217℃)of the base solder,and the tensile strength is 25.74 MPa,which achieves the purpose of low-temperature welding and high-temperature service.Comparing with Sn4.7Ag1.7Cu/Cu joints under reflow welding,with the aging process,the residual Ag particles in Sn4.7Ag1.7Cu+Ag composite solder/Cu joint are dissolved and a large number of Ag_(3)Sn compounds are produced near the interface of the joint.A large number of bulk Ag_(3)Sn compounds can effectively inhibit the diffusion of Sn into the Cu substrate and achieve the purpose of inhibiting the growth of the Cu_(3)Sn layer.Under the condition of service temperature of 200℃,with the aging process,the mechanical properties of the Sn4.7Ag1.7Cu+Ag composite solder/Cu joint first decrease and then increase,then decrease to a stable state,and its mechanical properties are better than that of the Sn4.7Ag1.7Cu/Cu joint.

关 键 词：SnAgCu复合钎料 回流焊 瞬时液相连接 Ag颗粒 

分 类 号：TG425[金属学及工艺—焊接]