基于热传导对电路板加热焊接炉温曲线的优化模型  

Optimal model for temperature curve of circuit board heating and soldering furnace based on heat conduction

作　　者：孙晨阳 汪雪琪 徐鑫鑫 SUN Chen-yang;WANG Xue-qi;XU Xin-xin(School of Statistics and Applied Mathematics,Anhui University of Finance and Economics,Anhui Bengbu 233030,China)

机构地区：[1]安徽财经大学统计与应用数学学院,安徽蚌埠233030

出　　处：《齐齐哈尔大学学报（自然科学版）》2021年第6期87-94,共8页Journal of Qiqihar University(Natural Science Edition)

基　　金：国家自然科学基金(71974001);安徽省教研项目(2018jyxm1305);安徽财经大学教研项目(acjyyb2020011)。

摘　　要：针对回焊炉温度设定问题,利用偏微分方程模型对区间间隙的传热效应进行分析,综合运用傅里叶定律、牛顿冷却定律,构建了基于傅里叶定律的热传导模型以及目标规划模型,计算出回焊炉内电路板焊接区域中心的温度,最终得出最优的炉温曲线,以及不同温区可能允许的最大传送带过炉速度等。According to the temperature setting of the reflow furnace,the partial differential equation model is used to analyze the heat transfer effect of the interval gap,and the Fourier law and Newton cooling law are used comprehensively to construct a heat conduction model based on the Fourier law and a target planning model.Calculate the temperature of the center of the circuit board welding area in the reflow furnace,and finally get the optimal furnace temperature curve,as well as the maximum conveyor belt passing speed that may be allowed in different temperature zones.

关 键 词：偏微分方程 傅里叶定律 牛顿冷却定律 热传导 炉温曲线 

分 类 号：TN405[电子电信—微电子学与固体电子学]