P对Sn-9Zn-0.1S无铅钎料性能的影响  

Effect of P on Properties of Sn-9Zn-0.1S Lead-Free Solder

作　　者：李玲妹 黄惠珍[1] 张青环 帅歌旺[2] LI Lingmei;HUANG Huizhen;ZHANG Qinghuan;SHUAI Gewang(School of Materials Science and Engineering,Nanchang University,Nanchang 330031,China;School of Aeronautical Manufacturing Engineering,Nanchang HangKong University,Nanchang 330063,China)

机构地区：[1]南昌大学材料科学与工程学院,南昌330031 [2]南昌航空大学航空制造工程学院,南昌330063

出　　处：《材料研究学报》2021年第8期615-622,共8页Chinese Journal of Materials Research

基　　金：江西省自然科学基金(20181BAB206010)。

摘　　要：为研究P含量对Sn-9Zn-0.1S钎料显微组织、抗氧化性、润湿性及耐腐蚀性能的影响,通过光学显微镜观察钎料的显微组织,采用静态刮渣法测定钎料在不同温度下的抗氧化性能,用润湿铺展面积评价不同温度下钎料在Cu基板上的润湿性,采用腐蚀失重法衡量钎料在pH值为3.7的HCl溶液中的耐腐蚀性,并通过扫描电镜(SEM)和X射线衍射仪(XRD)对钎料在不同温度下的氧化产物和酸性腐蚀条件下形成的腐蚀产物进行形貌观察和物相分析。结果表明:适量P的添加可以细化Sn-9Zn-0.1S钎料层片状共晶组织,但短棒状富Zn相随P的添加而变长、变粗且数量减少;钎料的抗氧化性及润湿性能随P的添加先提高后降低,P含量在0.06%时钎料的抗氧化性及润湿性最好;同时,P通过改善钎料显微组织及腐蚀产物的致密性,提高了钎料的耐腐蚀性能,P含量在0.1%时钎料的耐腐蚀性能较好。The effect of P addition on the microstructure,oxidation resistance,wettability and corrosion resistance of Sn-9Zn-0.1S solder alloy were characterized via optical microscope observation,scanning electron microscopy(SEM)and X-ray diffractometer(XRD),as well as dross removal measurement at different temperatures,spreading area on Cu plate and weight loss measurement after immersion in HCl solution respectively.The results show that P addition can refine the lamellar eutectic microstructures,but coarsen the rod-like primary Zn-rich phases.The oxidation resistance and wettability of the solder can be firstly increased with the addition of P,then this effect reduces,and the optimal P content is 0.06%(mass fraction).At the same time,a suitable amount of P addition can also improve the corrosion resistance of Sn-9Zn-0.1S solder alloy by modifying its microstructure and increasing the density of corrosion products.It is found that the weight loss is the minimum when the P content is 0.1%(mass fraction).

关 键 词：金属材料 Sn-9Zn-0.1S无铅钎料 抗氧化性 润湿性 耐腐蚀性 

分 类 号：TG425[金属学及工艺—焊接]