光敏聚酰亚胺光刻胶研究进展  

Progress Research on Photosensitive Polyimide

作　　者：郭海泉[1] 杨正华[1] 高连勋[1] GUO Hai-Quan;YANG Zheng-Hua;GAO Lian-Xun(Lab of Polymer Composites Engineering,Changchun Institute of Applied Chemistry,Chinese Academy of Sciences,Changchun 130022,China)

机构地区：[1]中国科学院长春应用化学研究所,高分子复合材料工程实验室,长春130022

出　　处：《应用化学》2021年第9期1119-1137,共19页Chinese Journal of Applied Chemistry

基　　金：国家重点研发计划(No.2017YFB0404700)资助。

摘　　要：近年来,光敏聚酰亚胺(PSPI)在先进封装、微机电系统和有机发光二极管(OLED)显示等新兴领域的需求牵引下得到了快速发展。在基础研究、应用研究以及产业化方面,PSPI的进展都引起了广泛关注。光敏聚酰亚胺作为一种实用的可自图案化薄膜材料显示出越来越突出的重要性。本文综述了近年来正性、负性光敏聚酰亚胺的结构设计、光化学反应及其感光性能等方面的研究进展,简要介绍了在集成电路、微机电系统以及OLED显示等方面的应用需求,最后对光敏聚酰亚胺在研究和应用中存在的问题及其前景进行了展望。In recent years,photosensitive polyimide(PSPI)has been rapidly developed under the demand of high-tech fields such as advanced packaging technology,microelectromechanical systems,and organic light-emitting diode(OLED)displays.The progress of PSPI has attracted widespread attention in terms of basic research,application,and industrialization.Photosensitive polyimide shows an increasingly prominent importance as a practical self-patternable film.This paper reviews the recent research progress in the structural design,photochemical reaction and light-sensitive properties of positive and negative photosensitive polyimides,briefly introduces the application in the field of the integrated circuits,microelectromechanical systems and OLED displays,and finally gives an outlook on the development of photosensitive polyimides in research and applications.

关 键 词：光敏聚酰亚胺 光刻胶 再布线 集成电路 有机发光二极管显示 微机电系统图案化 

分 类 号：O631[理学—高分子化学]