高光谱用长波红外焦平面探测器组件  

The long wave infrared focal plane detector assembly for hyperspectral applications

作　　者：于小兵 岳冬青[1] 王成刚[1] 宁提[1] 李敬国[1] 李艳红 YU Xiao-bing;YUE Dong-qing;WANG Cheng-Gang;NING Ti;LI Jing-guo;LI Yan-hong(The 11th Research Institute of CETC,Beijing 100015,China)

机构地区：[1]中国电子科技集团公司第十一研究所,北京100015

出　　处：《激光与红外》2021年第9期1196-1199,共4页Laser & Infrared

基　　金：国家重点研发计划项目(No.2016YFB05500504)资助。

摘　　要：介绍了高光谱用长波1024×256红外焦平面探测器组件的研究结果。长波红外焦平面探测器芯片基于液相外延碲隔汞薄膜材料制造,读出电路基于035μmCMOS 50 V工艺设计,采用非密封型与高光谱相机集成的探测器封装结构。经测试,长波1024×256红外焦平面探测器组件各项功能正常,性能良好。The research results of the long wave 1024×256 infrared focal plane detector assembly for hyperspectral applications are introduced.The long wave infrared detector chip is based on liquid epitaxial HgCdTe film material,the readout circuit is designed based on 0.35 CMOS 5.0V process,and the detector package structure is unsealed type and integrated with hyperspectral camera.The test results show that the long wave 1024×256 infrared focal plane detector assembly has normal functions and excellent performance.

关 键 词：高光谱 长波 碲镉汞 探测器 读出电路 封装 

分 类 号：TN214[电子电信—物理电子学]