不同回流焊工艺对厚膜基板背面焊点可靠性影响的研究  

Study on Influence of Different Reflow Soldering Process on Reliability of Solder Joints on the Backside of Thick Film Substrate

作　　者：张坤 潘园园 周婷[1] 曾辉[1] ZHANG Kun;PAN Yuan-yuan;ZHOU Ting;ZENG Hui(No.43 Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,合肥230088

出　　处：《混合微电子技术》2020年第3期45-51,共7页Hybrid Microelectronics Technology

摘　　要：我所常用回流焊工艺为热板回流焊工艺和回流炉焊接工艺,不同回流焊工艺的焊接过程和控制要求存在一定差别。我所某类重点型号产品现阶段采用热板回流焊工艺,随着产量的不断增加和批次一致性要求的提高,该类型号产品对于回流炉焊接工艺的应用有着迫切的需求。本文利用SEM和EDS对环境试验前后热板回流焊工艺和回流炉焊接工艺形成的基板背面焊点进行微观分析,研究不同回流焊工艺对基板背面焊点可靠性的影响。研究结果表明,两种焊接工艺下焊锡与基板Ag层以及管壳Ni/Au镀层均形成良好的冶金结合,可靠性无明显差异,但回流炉焊接在生产效率和批次一致性方面有明显优势,可以更好的适应高等级军用混合集成电路产品的生产。The commonly used reflow soldering processes in our t ompany are hot plate reflow soldering process and reflow furnace soldering process.Different reflow soldering processes and control requirement is different to some extent.At present,hot plate reflow soldering process is adopted for a certain key type of product of our company.With the continuous incress of output and the improvement of consistency requirements,this type of products have an urgent demand for the application of reflow furnace soldering process.In this paper,the hot plate reflow soldering process and reflow furnae soldering process before and after the environment test by SEM and EDS analysis were used to conduct microscopic analysis on the backsides solder joint of the substrate,and the influence of different reflow soldering processes on the reliability of the backside solder joint was studied.The results show that under the two welding process,good metallurgical bonding is formed between the solder and the Ag layer of the substrate and the Ni/Au coating of the package.At the same time,due to the great advantages of reflow furnace soldering in terms of production efficiency and consistency,which can better adapt to the production of high grade military hybrid integrated circuit products.

关 键 词：焊接工艺 SEM&EDS 微观形貌 环境试验 

分 类 号：TG457.1[金属学及工艺—焊接]