通孔基板与无通孔基板耐过载水平分析  

Analysis on Overload Resistance Level of Through-hole Substrate and Non-through-hole Substrate

作　　者：侯育增 臧子昂 魏刚剑 HOU Yu-zeng;ZANG Zi-ang;WEI Gang-jian(No.214 Research Institute of CNIGC Ltd.,Bengbu 233030,China)

机构地区：[1]华东光电集成电路研究,蚌埠233000

出　　处：《混合微电子技术》2020年第4期52-54,共3页Hybrid Microelectronics Technology

摘　　要：研究陶瓷基板组装技术能够承受的耐过载范围,对厚膜混合集成电路在不同武器装备中的适用性具有十分重要的意义。本文通过分组试验,汇总了含通孔陶瓷基板与无通孔陶瓷基板在不同基板尺寸、有无通孔等情况下的耐过载范围,分析了影响陶瓷基板耐过载水平的各类因素,这对具有耐过载要求的电路提供了初始设计依据,对于微电路耐高过载和高可靠研究技术提供了起始参考。The main research focus is on the anti-overload range of ceramic substrate assembly technology,so it's instructive to the application of different armaments&equipment.This paper has gathered typical ceramic substrate assembly anti-load ranges in terms of different substrate dimension,through-hole substrate and non-through-hole substrate,various external packages,and it analyzed verified segments that impacting ceramic substrate anti-overload level,thus providing initial design foundation for the certain overload-requiring circuits,and providing original support for the institute microcircuits anti-overload and high-relia­bility research technology.

关 键 词：过载水平 陶瓷基板 机械冲击 

分 类 号：TN305.94[电子电信—物理电子学]