大尺寸光学玻璃封装工艺研究  

Packaging Process Study on Large Size Optical Glass

作　　者：李杰 何中伟 金龙 LI Jie;HE Zhong-wei;JIN Long(No.214 Research Institute of CNIGC Ltd.,Suzhou 215163,China)

机构地区：[1]中国兵器工业第214研究所,苏州215163

出　　处：《混合微电子技术》2020年第4期68-71,76,共5页Hybrid Microelectronics Technology

摘　　要：优选一种双阶段固化胶作为封装粘接材料,通过胶带印刷涂敷、逸气缝道制备、主固化预热排气、加压夹持封盖等方面的工艺研究,并经工艺控制验证及量产加工考核,有效掌握了CIS器件的110mm×110mm大尺寸光学玻璃封装工艺,满足产品应用要求。A two-stage curing epoxy was optimized,the processes like the epoxy strip pattern print coating,air-leaking crevasses making,main curing preheat exhaust,pressure clamped lid covering,etc.were studied,and the process control verification and volume production check were passed through.Therefore,the 110mm×110mm large size optical glass packaging process of CIS devices was practically mastered and can meet the needs of product applications.

关 键 词：CMOS图像传感器 玻璃封装 双阶段固化 印刷涂敷 逸气缝道 预热排气 

分 类 号：TN305.94[电子电信—物理电子学]