焊锡膏成分的定性定量综合分析技术  

Qualitative and Quantitative Comprehensive Analysis of Solder Paste Composition

作　　者：张莹洁 陈斌 丁勇 王玉[3] 刘子莲[1] 倪毅强 ZHANG Yingjie;CHEN Bin;DING Yong;WANG Yu;LIU zilian;NI Yiqiang(The 5th Research Institute of MII,Guangzhou 511370,China;Zoomlion Heavy Industry Science&Technology Co.,Ltd.,Changde 415000,China;Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370 [2]中联重科股份有限公司,湖南常德415000 [3]中兴通讯股份有限公司,广东深圳518057

出　　处：《电子工艺技术》2021年第6期328-330,337,共4页Electronics Process Technology

基　　金：工信部高质量发展专项资助项目(2020-0093-2-1)。

摘　　要：焊锡膏的材料一致性关乎产品的批次稳定性,有必要开展对焊锡膏成分的定性定量分析研究工作。采用熔融冷却、溶剂溶解和离心分离等手段对焊锡膏进行预处理,得到金属、溶液和悬浮物三部分。再通过电感耦合等离子体发射光谱仪(ICP-OES)、气相色谱-质谱联用仪(GC-MS)、傅里叶变换红外光谱仪(FT-IR)对这三部分的成分进行定性定量分析。结果表明:焊锡膏中各成分和含量(以质量百分数计)分别是锡(85.5443)、银(2.5502)、铜(0.4498)、三丙二醇单丁醚(5.7625)、2-乙基咪唑(0.3494)、正葵酸(0.1460)、己二酸(0.4915)、苯并三氮唑(0.1706)、5-甲基苯并三氮唑(0.1017)、2.4-二叔丁基苯酚(0.0065)、白油(0.6899)、酰胺类低聚物(0.1081)和松香(3.6295)。提出了针对焊锡膏产品的成分定性定量分析研究方法,具有一定的借鉴和指导意义。The material consistency of solder paste is related to the batch stability of products.It is necessary to carry out qualitative analysis and quantitative analysis on solder paste composition.The solder paste is pretreated by melting cooling,solvent dissolution and centrifugal separation to obtain three parts:metal,solution and suspended matter,which are qualitative and quantitative analyzed by inductively coupled plasma optical emission spectrometry(ICP-OES),gas chromatography-mass spectrometer(GC-MS)and fourier transform infrared spectroscopy(FT-IR)separately.The results show that the mass fraction of each component in solder paste is as follows:Sn(85.5443%),Ag(2.5502%),Cu(0.4498%),tri(propylene glycol)butyl ether(5.7625%),2-ethylimidazole(0.3494%),decanoic acid(0.1460%),adipic acid(0.4915%),1H-benzotriazole(0.1706%),5-methyl-1H-benzotriazole(0.1017%),2.4-di-t-butylphenol(0.0065%),mineral oil(0.6899%),amide oligomer(0.1081%)and rosin(3.6295%).The research of qualitative and quantitative analysis of solder paste is put forward,which has certain reference and instructiveness.

关 键 词：焊锡膏 定性分析 定量分析 成分 

分 类 号：TN04[电子电信—物理电子学]