塑封LGA器件回流焊工艺的可靠性分析  

Reliability Analysis of Reflow Soldering Process for Plastic Packaging LGA Devices

作　　者：李苗 周自泉 宋惠东 程明生[1] LI Miao;ZHOU Ziquan;SONG Huidong;CHENG Mingsheng(The 38th Research Institute of CETC,Hefei 230031,China)

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230031

出　　处：《电子工艺技术》2021年第6期331-333,337,共4页Electronics Process Technology

摘　　要：LGA(Land Grid Array)器件封装引脚数目多、集成度高,且由于焊点高度小而具有优异的抗振动、抗弯曲、抗跌落性能,已成为民用和军用电子产品优选封装器件。某项目研制阶段用塑封LGA器件在回流焊接后出现分层、多余物残留等焊接缺陷。为解决此问题,从元器件存储、元器件预处理、钢网模板设计和回流焊工艺参数优化等多方面进行工艺改进,获得符合要求的焊接质量,满足电性能要求。LGA(Land Grid Array)device has a large number of pins,high integration,and because of its small solder joint height,it has excellent anti-vibration,anti-bending and anti-drop properties.It has become the preferred packaging device for civilian and military electronic products.In the development stage of a project,the plastic packaging LGA device has soldering defects such as delamination and excess residue after reflow soldering.In order to solve these problem,the study on soldering LGA device is explored from aspects of device storage,device pretreatment,stencil template design and reflow soldering process.By optimizing soldering process,high soldering quality and electrical performance are realized.

关 键 词：塑封LGA器件 回流焊 多余物残留 可靠性 

分 类 号：TN405[电子电信—微电子学与固体电子学]