LDI造成的孔无铜分析与改善  

Analysis and improvement of copper-free holes caused by LDI

作　　者：许校彬 樊佳 Xu Xiaobin;Fan jia(Glorysky Electronic Technology Co.,Ltd.Guangdong Huizhou 516369)

机构地区：[1]特创电子科技股份有限公司,广东惠州516369

出　　处：《印制电路信息》2021年第11期6-9,共4页Printed Circuit Information

摘　　要：文章主要分析了激光直接成像(LDI)生产制造中造成孔无铜缺陷及改善预防措施,并且详细介绍了如何通过设备改造降低LDI生产过程中导致镜头雾化的孔无铜异常。The article mainly analyzes the hole-free copper defects in LDI manufacturing and the improvement and preventive measures,and introduces in detail how to reduce the defect of no copper in hole caused by lens fogging in the LDI production process through equipment modification.

关 键 词：激光直接成像 镀通孔无铜 改善措施 

分 类 号：TN41[电子电信—微电子学与固体电子学]