电路板应用泡沫铜复合相变材料热控数值模拟研究  

Numerical Simulation of Thermal Control of Foam Copper Composite Phase Change Material in Printed Circuit Board

作　　者：田静[1] 苏欣 阎德劲[1] TIAN Jing;SU Xin;YAN De-jin(Southwest China Institute of Electronic Technology,Chengdu 610036)

机构地区：[1]中国电子科技集团公司第十研究所,成都610036

出　　处：《环境技术》2021年第5期155-163,共9页Environmental Technology

基　　金：国防科研项目(TDZX-17-048-2)。

摘　　要：本文应用焓-多孔介质模型数值模拟研究电子设备热控系统性能。利用某航天电子设备作为研究对象,采用正二十四烷/泡沫铜复合相变材料作为热控组件。根据电路板芯片额定功率完成热源分布和热量加载,通过瞬态升温过程研究初始设计的相变装置热控性能。主要关注芯片的温度变化、温度均匀性、相变热控装置内固液相界面变化及温度分布情况,分析相变热控装置的可靠性、可行性。从而提供一种电路板应用泡沫铜复合相变材料热控装置的数值模拟方法。In this paper,the enthalpy porous media model is used to simulate the performance of the thermal control system of the electronic equipment.Using a certain aerospace electronic equipment as the research object,the composite is made of n-tetracosane/foam copper composite phase change material.According to the rated power of the circuit board chip,the heat source distribution and heat loading are completed,and the thermal control performance of the initial design phase change device is studied through the transient heating process.This paper mainly focuses on the temperature change,temperature uniformity,solid-liquid interface change and temperature distribution of the chip,and analyzes the reliability and feasibility of the phase change thermal control device.Thus,a numerical simulation method for the thermal control device of foam copper composite phase change material in circuit board is provided.

关 键 词：相变材料 泡沫铜 热管理 电子设备 数值模拟 

分 类 号：TH12[机械工程—机械设计及理论]