关于HIC、MCM、SIP封装与SOC的区别及工艺分析  

The Difference and Process Analysis of HIC,MCM,SIP and SoC

作　　者：杨跃胜[1] 傅霖煌 YANG Yue-sheng;FU Lin-huang(Invengo Information Technology Co.,Ltd)

机构地区：[1]深圳市远望谷信息技术股份有限公司芯片研发中心

出　　处：《中国集成电路》2021年第11期65-69,共5页China lntegrated Circuit

摘　　要：本文分别从芯片设计技术和芯片封装技术的维度,针对解决电子产品对芯片小型化、性能优、功能强的要求,对SOC片上系统及HIC、MCM、SIP封装技术的特点进行分析,并给出其相互关系,最终提出SOC片上系统芯片设计和SIP封装技术的各自应用范围,这对于SOC及先进封装技术均有一定指导作用。From the dimension of chip design technology and chip packaging technology,the paper solves the requirements of electronic products for chip miniaturization,excellent performance and strong function.The characteristics of SoC and HIC,MCM and SIP package technology are analyzed,and their mutual relations are given.Finally,the application scope of SOC technology and SIP package technology is proposed,which has a guiding role for SOC and advanced package technology.

关 键 词：SOC SIP 芯片封装 MCM HIC 

分 类 号：TN453[电子电信—微电子学与固体电子学]