DMSA在时序签核中的应用  被引量:1

Application of DMSA in timing sign-off

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作  者:孙恒 王仁平[1] 蔡沅坤 Sun Heng;Wang Renping;Cai Yuankun(Fuzhou University,University of Physics and Information Engineering,Fuzhou 350000,China)

机构地区:[1]福州大学物理与信息工程学院,福建福州350000

出  处:《电子技术应用》2021年第11期44-46,共3页Application of Electronic Technique

基  金:福建省自然科学基金(2018J01803)。

摘  要:在芯片的设计过程中,静态时序分析(Static Timing Analysis,STA)无疑是整个设计中最重要的一环。如今纳米级工艺下的芯片设计往往属于多工艺角多模式(MultiCorner-MultiMode,MCMM)物理设计,工艺角和工作模式的特定组合称之为场景,多场景的物理设计会给芯片带来更加稳定的性能,但也会使静态时序分析变得更为复杂。介绍了分布式多场景时序分析(Distribute Multi_Scenario Analysis,DMSA)技术在多工艺角多模式物理设计中的应用。经过基于Smic 90 nm工艺的多场景数字芯片Cxdp13设计实践分析表明,在一定硬件条件支撑下,分布式多场景时序分析技术在多工艺角多模式的物理设计中可以达到快速时序签核的目的。In the process of chip design,static timing analysis is undoubtedly the most important part of the entire design,and it is a priority and problem to be solved in chip design.Nowadays,chip design under nano-scale technology often belongs to multicorner-multimode physical design.The specific combination of process angle and working mode is called scenario.Multi-scenario physical design will bring more stable performance to the chip,but it will also make static timing analysis becomes more complicated.This paper introduces the application of distribute multi-scenario analysis technology in multicorner-multimode physical design.The design practice analysis of the multi-scenario digital chip Cxdp13 based on the Smic 90 nm process shows that under certain hardware conditions,the distribute multi_scenario analysis technology can achieve the purpose of rapid timing sign-off in the physical design of multicorner-multimode.

关 键 词:分布式多场景时序分析 静态时序分析 多工艺角多模式 时序签核 时序工程改变命令 

分 类 号:TN431.2[电子电信—微电子学与固体电子学]

 

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