环氧树脂封装电子元件多层金属化的处理  

Multilayer Metallization Treatment of Epoxy Encapsulated Electronic Components

作　　者：张秀琴 ZHANG Xiu-qin(Xiamen Weiertong Technology Co.,Ltd.,Xiamen 361000,China)

机构地区：[1]厦门韦尔通科技有限公司,福建厦门361000

出　　处：《化工管理》2021年第32期169-170,共2页Chemical Engineering Management

摘　　要：环氧树脂是一种高分子聚合物,主要指的是分子物质之间至少两个以上环氧基团相互结合,由于环氧基的化学活性,可用多种含有活泼氢的化合物使其开环,固化交联生成网状结构,因此它是一种热固性树脂。双酚A型环氧树脂不仅产量最大,品种最全,而且新的改性品种仍在不断增加,质量正在不断提高。文章首先详细分析电子元件封装技术特点,并且以此作为基础条件,进一步总结出电子元件封装实验流程。Epoxy resin is a kind of high molecular polymer,which mainly refers to the combination of at least two epoxy groups between molecular substances.Because of the chemical activity of epoxy groups,it can be opened by various compounds containing active hydrogen,cured and crosslinked to form a network structure,so it is a thermosetting resin.Bisphenol A epoxy resin not only has the largest output and the most complete variety,but also the new modified varieties are increasing and the quality is improving.In this paper,firstly,the characteristics of electronic component packaging technology are analyzed in detail,and then the experimental flow of electronic component packaging is summarized.

关 键 词：环氧树脂 电子元件 金属化 技术特点 

分 类 号：TN41[电子电信—微电子学与固体电子学]