表面贴装结构SnAgCu焊点的热可靠性模拟  

Thermal Reliability Simulation of SnAgCu Solder Joints in Surface Mount Structure

作　　者：梁志敏[1,2] 申飞 杨宗渊 汪殿龙 王立伟[1,2] LIANG Zhimin;SHEN Fei;YANG Zongyuan;WANG Dianlong;WANG Liwei(School of Materials Science and Engineering,Hebei University of Science and Technology,Shijiazhuang 050018,China;Hebei Key Laboratory of Material Near-Net Forming Technology,Shijiazhuang 050018,China)

机构地区：[1]河北科技大学材料科学与工程学院,河北石家庄050018 [2]河北省材料近净成形技术重点实验室,河北石家庄050018

出　　处：《热加工工艺》2021年第21期108-112,共5页Hot Working Technology

基　　金：河北省重点研发计划资助项目(19250202D);国家自然科学基金资助项目(51875168)

摘　　要：基于双曲正弦蠕变模型,使用Abaqus软件对最低、最高温度不同的温度循环条件下片状器件SnAgCu焊点的寿命进行了模拟。结果表明,焊点等效应力随温度循环呈现周期性变化,最大应力集中于焊点与元器件的连接边缘处,最大应力随着温度循环曲线温差的增大而增大;等效蠕变随循环次数的增加以阶梯状累积增加,最大蠕变发生在焊点与元器件的交角处,残余应力和蠕变的最大值均随着最高温度、循环温差的增大而增大,随循环次数的增加而增大。基于累积蠕变-疲劳寿命模型预测焊点的疲劳寿命,结果表明焊点寿命随着温差的增大而减小。在实际应用中,要尽量缩小焊点所受的温差范围,以提高疲劳寿命。Based on the hyperbolic sine creep model,the life of SnAgCu solder joint of the chip electronic components was simulated by Abaqus software under temperature cycling conditions with different minimum and maximum temperatures.The results show that the equivalent stress of the solder joint changes periodically with the periodic change of the temperature.The maximum stress occurs at the edge between the solder joint and the component.With the increase of the temperature difference in temperature cycle curve,the maximum stress increases.The equivalent creep presents stair-step increasing trend with the increase of the cycle time.The position of the maximum creep is the corner between the solder joint and the component.The maximum values of residual stress and creep increase with the increase of the maximum temperature and cycle temperature difference,and increase with the increase of cycle times.The fatigue life of solder joints was predicted based on cumulative creep-fatigue life model,it shows that the life of the solder joint decreases with the increase of the temperature difference.In practical application,the temperature difference range of solder joint should be minimized to improve fatigue life.

关 键 词：有限元法 焊点 蠕变 应力场 疲劳寿命 

分 类 号：TG405[金属学及工艺—焊接]