聚硅炔酰亚胺树脂的固化特性  

Curing Behavior of Poly(silicon alkyne imide)Resin

作　　者：郭亚林[1] 崔红[1] 宋爽 高梁 林嘉平[2] 刘毅佳[1] 余惠琴[1] 刘晓红[1] GUO Yalin;CUI Hong;SONG Shuang;GAO Liang;LIN Jiaping;LIU Yijia;YU Huiqin;LIU Xiaohong(Xi'an Aerospace Composites Research Institute,Xi’an 710025,China;Shanghai Key Laboratory of Advanced Polymeric Materials,School of Materials Science and Engineering,East China University of Science and Technology,Shanghai 200237,China)

机构地区：[1]西安航天复合材料研究所,西安710025 [2]华东理工大学材料科学与工程学院,上海市先进聚合物材料重点实验室,上海200237

出　　处：《功能高分子学报》2021年第6期506-511,共6页Journal of Functional Polymers

摘　　要：聚硅炔酰亚胺(PSI)树脂是一种由聚酰亚胺与含硅芳炔共聚而成的树脂。通过对PSI树脂的结构表征、差示扫描量热(DSC)法测试、固化反应动力学和流变特性分析,初步确定了PSI树脂的固化工艺。结果表明,炔基是PSI树脂发生固化反应的主要活性基团。PSI树脂的固化反应初始温度相对较高,放热区间比较集中,固化反应的活化能为83.2 kJ/mol,频率因子为5.0×10^(12) s^(−1),反应级数为0.93。初步确定PSI树脂的固化工艺为:160℃,3 h→190℃,2 h→220℃,2 h→250℃,4 h。The curing behavior of poly(silicon-alkyne imide)(PSI)resin,which is prepared by copolymerizing polyimide(ATPI)designed by a material genome approach and silicon-containing arylacetylene(PSA),has been studied to meet the need of application study and property assessment of PSI resin.The characterization of molecular structure,differential scanning calorimetry(DSC)test,the analysis of the curing kinetics and rheological behavior for PSI resin were carried out and the curing processing of PSI resin was determined.The results indicate that PSI resin is cured by the reaction of alkynyl groups at the molecular of the copolymer according to infrared spectroscopy(IR)analysis and thermogravimetric(TG)analysis of PSI resin prior to and after curing.The initial reaction temperature and reaction enthalpy are relatively high when PSI resin is cured and the reaction heat is released at a relatively small temperature range.The activation energy,frequency factor and reaction order from analysis of the cure kinetics for the PSI resin curing reaction are 83.2 kJ/mol,5.0×10^(12) s^(−1) and 0.93,respectively.The curing processing of the PSI resin is initially determined to be 160℃,3 h→190℃,2 h→220℃,2 h→250℃,4 h.

关 键 词：聚硅炔酰亚胺树脂 固化 动力学 流变特性 

分 类 号：TB332[一般工业技术—材料科学与工程]