电镀锡工艺参数对挠性印制板焊盘回流焊缩锡问题的影响  

Effect of tin plating process parameters on tin shrinkage after reflow soldering of Flexible Printed Board pad

作　　者：唐小侠 王杰 孙茜 Tang Xiaoxia;Wang Jie;Sun Qian(MFLEX Suzhou Co.Ltd,Suzhou,Jiangsu,215128;School of Iron and Steel,Soochow University,Suzhou,Jiangsu,215002;School of mechanical and electrical engineering,Soochow University,Suzhou,Jiangsu,215002)

机构地区：[1]苏州维信电子有限公司,江苏苏州215128 [2]苏州大学沙钢钢铁学院,江苏苏州215002 [3]苏州大学机电工程学院,江苏苏州215002

出　　处：《印制电路信息》2021年第12期35-40,共6页Printed Circuit Information

摘　　要：文章从挠性印制电路板镀锡焊盘缩锡问题实例出发,研究了一种甲基磺酸盐体系电镀锡工艺参数对焊盘缩锡问题的影响,包括电镀锡镀液组分,电流密度,温度,以及搅拌速度。经过霍尔槽试验和模拟回流焊测试方法的判定,结果表明:电镀锡镀液组分、电流密度、温度、以及搅拌速度均对缩锡问题存在一定的影响,同时明确了各工艺参数的最佳控制范围。Based on FPCB production case with solder pad shrinkage defect after reflow,this article studied and discussed electro-tin plating parameters’affection to FPCB pad shrinkage defect after reflow soldering,whose chemical system is the methane sulfonic acid salt(MSA)electro-tin plating chemical system.The electro-tin plating parameters including chemical contents,current density,temperature and chemical agitation.Based on testing results of the hull cell test and reflow simulation test,above parameters all have effect on shrinkage and the best control window for the parameters will come out.

关 键 词：挠性印制电路板 缩锡 回流焊 电镀锡 

分 类 号：TN41[电子电信—微电子学与固体电子学]