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作 者:左陈 李涛 伍宏奎[1] 茹敬宏[1] Zuo Chen;Li Tao;Wu Hongkui;Ru Jinghong(National Engineering Research Center of Electronic Circuits Base Materials,Shengyi Technology Co.,Ltd.,Dongguan 523808,China)
机构地区:[1]广东生益科技股份有限公司国家电子电路基材工程技术研究中心,广东东莞523808
出 处:《印制电路信息》2021年第12期41-44,共4页Printed Circuit Information
摘 要:将透明胶粘剂涂布在PET膜表面,与铜箔贴合,固化后即得到PET基透明挠性覆铜板。考察透明挠性覆铜板的基本性能,结果表明:所制备的透明胶粘剂具有优异的透光性,贴合铜箔会使涂胶PET膜的可见光透过率降低,贴合覆盖膜后,可见光透过率可以得到恢复。透明挠性覆铜板蚀刻后,再与覆盖膜贴合,具有较好的耐湿热老化性能。浮焊测试结果显示,PET基透明挠性覆铜板可以适用于温度≤215℃的低温焊接工艺。PET基透明挠性覆铜板的基本性能满足IPC-4204A标准要求。A transparent adhesive was coated on PET film,covered with copper foil,and cured to prepare PET based transparent FCCL.The basic performance of PET based transparent FCCL was investigated.The result shows that the transparent adhesive has excellent transparency.Covering copper foil on coating PET can reduce the transmittance of visible light of coating PET.The transmittance of visible light of etched PET based transparent FCCL can be restored after laminating coverlay.The PET based transparent FCCL shows excellent hydrothermal ageing properties.The solder float test result shows that the PET based transparent FCCL can meet the demand of low temperature welding process whose soldering temperature lower than 215℃.The basic performance of PET based transparent FCCL can meet IPC-4204A requirements.
关 键 词:透明挠性覆铜板 透明胶粘剂 可见光透过率 铜箔 聚酯膜
分 类 号:TN41[电子电信—微电子学与固体电子学]
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