X波段T/R组件键合金丝的自动检测技术  

Automatic detection technology of gold bonding wires in X-band T/R module

作　　者：马美铭 禹胜林[1] 张杰 王雨壮 周为荣 Ma Meiming;Yu Shenglin;Zhang Jie;Wang Yuzhuang;Zhou Weirong(School of Electronic&Information Engineering,Nanjing University of Information Science&Technology,Nanjing 210000,China)

机构地区：[1]南京信息工程大学电子与信息工程学院,南京210000

出　　处：《电子测量技术》2021年第17期118-122,共5页Electronic Measurement Technology

摘　　要：X波段T/R组件中,键合金丝的数量、长度、拱高、跨距、焊点位置等参数会对微波传输特性产生严重的影响。通过自动检测技术实现上述参数的自动检测,可以推断出X波段T/R组件键合质量是否合格。基于变焦显微测量技术,通过自主设计的图像采集平台,获取到键合金丝的一组图像,然后通过多聚焦图像融合、聚焦评价等图像处理技术,实现了键合金丝的拱高和跨度的微米级测量,测量结果相对误差小于0.7%。该方法该技术有利于提高金丝键合成品质量的检测效率,提高X波段T/R组件的生产效率。In X-band T/R module, the number, length, arch height, span, solder joint position and other parameters of gold bonding wires will have a serious impact on the microwave transmission characteristics. Through the automatic detection technology to achieve the automatic detection of the above parameters, we can infer whether the bonding quality of X-band T/R module is qualified. Based on the focus variation measurement technology, the micron scale parameter measurement of the gold bonding wires is realized, and the relative error of the measurement result is less than 0.7%. In this method, a group of images of the gold bonding wires are obtained through the self-designed image acquisition platform, and then the arch height and span of the gold bonding wires are measured through image processing technologies such as multi focus image fusion and focus evaluation. This technology is helpful to improve the detection efficiency of gold wire bonding products and the production efficiency of X-band T/R module.

关 键 词：T/R组件 键合金丝 变焦显微测量 模板匹配 多聚焦图像融合 聚焦评价 

分 类 号：TP29[自动化与计算机技术—检测技术与自动化装置]