改善磁控溅射铜膜与聚碳酸酯基体结合力的研究  

Study on improving the adhesion of magnetron-sputtered copper film to polycarbonate substrate

作　　者：曹晓雪 张虎林 刘超[1] 刘惠涛[1] 高原[1] CAO Xiaoxue;ZHANG Hulin;LIU Chao;LIU Huitao;GAO Yuan(College of Chemistry and Chemical Engineering,Yantai University,Yantai 264005,China)

机构地区：[1]烟台大学化学化工学院,山东烟台264005

出　　处：《电镀与涂饰》2021年第23期1771-1775,共5页Electroplating & Finishing

基　　金：国家自然科学基金(51573155)。

摘　　要：在水热条件下以H_(2)O_(2)对聚碳酸酯(PC)表面进行改性。用射频磁控溅射法在原始PC以及改性PC表面制备金属Cu膜。用原子力显微镜(AFM)表征不同溅射功率沉积的Cu膜的表面形貌,用划格试验和浸泡试验评价薄膜的结合力。结果表明:50℃的H_(2)O_(2)水热处理后的PC表面可有效提高Cu膜与PC的界面结合力,50 W溅射功率下制备的Cu膜具有一定的抗水汽侵蚀能力。The surface of polycarbonate(PC)was modified by H_(2)O_(2) under hydrothermal conditions.Cu films were prepared on the surface of unmodified and modified PC surfaces by radio frequency magnetron sputtering.The surface morphologies of the Cu films deposited at different sputtering powers were characterized by atomic force microscopy(AFM),and the adhesion of Cu film to PC substrate was evaluated through cross-cut test and immersion test.The results showed that the interfacial bonding between Cu film and PC substrate can be effectively improved by hydrothermal treatment of PC in H_(2)O_(2) solution at 50℃.The Cu film prepared at a sputtering power of 50 W has a certain resistance to water vapor erosion.

关 键 词：聚碳酸酯 过氧化氢 水热反应 表面改性 铜膜 磁控溅射 结合力 

分 类 号：O633.14[理学—高分子化学]