低银系无铅焊料合金界面结构研究  

Welding Interface Structure of Low-Silver Lead-Free Solder Alloy

作　　者：陈东东[1] 甘有为 易健宏[1] 白海龙 张欣 严继康[1,4] 秦俊虎 卢红波 赵玲彦 CHEN Dongdong;GAN Youwei;YI Jianhong;BAI Hailong;ZHANG Xin;YAN Jikang;QIN Junhu;LU Hongbo;ZHAO Lingyan(Kunming University of Science and Technology,Faculty of Materials Science and Engineering,Kunming 650093;R&D Center of Yunnan Tin Group(Holding)Co.,Ltd.,Kunming 650000;Yunnan Tin Industry Tin Material Co.,Ltd.,Kunming 650217;School of Engineering,Southwest Petroleum University,Nanchong 637001,China)

机构地区：[1]昆明理工大学材料科学与工程学院,云南昆明650093 [2]云南锡业集团(控股)有限责任公司研发中心,云南昆明650000 [3]云南锡业锡材有限公司,云南昆明650217 [4]西南石油大学工程学院,四川南充637001

出　　处：《昆明理工大学学报（自然科学版）》2021年第6期37-43,共7页Journal of Kunming University of Science and Technology(Natural Science)

基　　金：云南省重大科技专项计划(2018ZE004);云南省科技人才与平台计划(202105AE160028)。

摘　　要：电子锡焊料合金的焊接界面的金属间化合物具有硬而脆的特性,在应力影响下易产生裂纹,进而引发断裂失效.研究界面金属间化合物层的结构、形貌和服役条件下的变化,对提高焊料合金的可靠性具有重要意义.采用实验和数值计算的方法,研究Sn0.1Ag0.7Cu、Sn0.3Ag0.7Cu、Sn0.5Ag0.7Cu、Sn0.8Ag0.7Cu、Sn1.0Ag0.7Cu焊料合金的金属间化合物结构和形貌,并进行了室温和高温高湿条件下的老化试验,研究界面形貌,厚度变化.研究表明:焊接完成后的界面形貌不平滑,部分金属间化合物异常长大,经过高温高湿试验后,焊接界面变得比较均匀、平滑;随着Ag含量的升高,界面的生长活化能呈先升高后降低,当Ag含量为0.3%时,具有最大的活化能78.9 kJ/mol,界面金属间化合物较为稳定,服役可靠性较高.The intermetallic compound of the welding interface of solder alloy has the characteristics of hard and brittle,and it is prone to crack under the influence of stress,which in turn leads to fracture failure.Therefore,it is of great significance to study the structure,morphology and service conditions of intermetallic compound layers for improving the reliability of solder alloys.The structure and morphology of intermetallic compounds of Sn 0.1 Ag0.7Cu,Sn0.3Ag0.7Cu,Sn0.5Ag0.7Cu,Sn0.8Ag0.7Cu and Sn1.0Ag0.7Cu solder alloys are studied by experimental and numerical methods.The changes of interface morphology and thickness are studied by aging test at room temperature and high temperature and humidity.The results show that the interface morphology after welding is not smooth,and some intermetallic compounds grow up unusually.After the high temperature and humidity test,the welding interface becomes more uniform and smooth.With the increase of Ag content,the growth activation energy of the interface first increases and then decreases.When the Ag content was 0.3%,the maximum activation energy is 78.9 kJ/mol,and the intermetallic compound is relatively stable with high service reliability.

关 键 词：SNAGCU Cu基板 金属间化合物 时效 

分 类 号：TG42[金属学及工艺—焊接] TN41[电子电信—微电子学与固体电子学]