EMC中脱气剂的应用研究  

Application Research of Defoamer in EMC

作　　者：潘旭麒 李进 袁健 PAN Xuqi;LI Jin;YUAN Jian(Eternal Electronic Materials Co.,Ltd.,Kunshan 215301,China)

机构地区：[1]长兴电子材料有限公司,江苏昆山215301

出　　处：《电子与封装》2021年第12期35-39,共5页Electronics & Packaging

摘　　要：环氧塑封料(Epoxy Molding Compound,EMC)中的气泡往往会带来各种缺陷,从而降低产品合格率。针对3种不同类型的脱气剂进行研究,解释脱气剂脱气机理,确定3种脱气剂的脱气效果及其对环氧塑封料性能的影响。最终结果表明改性聚硅氧烷型脱气剂更适用于EMC体系,加入后能有效减少样条内部气泡,提高材料的耐冲击性能,有效改善MSL-3后的分层情况,从而提高产品的可靠性。The bubbles in the epoxy molding compound(EMC)often bring various defects,thereby reducing the product qualification rate.Three different types of defoamers are studied,the defoaming mechanism of the defoamers is explained,and the defoaming effects of the three defoamers and their influence on the performance of epoxy molding compounds are determined.The final result shows that the solvent-free polyether modified polysiloxane defoamer is more suitable for EMC system.After adding,it can effectively reduce the internal air bubble of the spline,improve the impact resistance of the material,and effectively improve the delamination after MSL-3,thereby improving the reliability of the product.

关 键 词：环氧塑封料 气泡 脱气剂 分层 

分 类 号：TN305.94[电子电信—物理电子学]