全自动化学抛光机系统设计  

System Design of Full-automatic Chemical Polishing Equipment

作　　者：薛书亮 张博 赵永进[1] 王文丽[1] 潘峰[1] 陈威[1] XUE Shuliang;ZHANG Bo;ZHAO Yongjin;WANG Wenli;PAN Feng;CHEN Wei(The 45^(th) Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2021年第6期28-31,共4页Equipment for Electronic Products Manufacturing

摘　　要：针对碲锌镉晶片的化学抛光处理工艺需求,按照全自动工艺处理要求,设计了一套全自动化学抛光设备,实现了自动上下料、自动抛光、自动清洗吹干等工艺步骤,并介绍了全自动化学抛光设备的系统设计及实现。Aiming at the demand analysis of the chemical polishing process of CdZnTe wafer,according to the requirements of full-automatic process processing,a set of full-automatic chemical polishing equipment is designed to realize the process steps of automatic loading and unloading,automatic polishing,automatic cleaning and drying,and the system design and implementation of full-automatic chemical polishing equipment are introduced.

关 键 词：碲锌镉晶片 化学抛光机 系统设计 

分 类 号：TN305[电子电信—物理电子学]