Ni-GNSs增强Sn2.5Ag0.7Cu0.1RE复合钎料/Cu钎焊接头热迁移组织与性能  

Microstructure and Properties of Ni-GNSs Reinforced Sn2.5Ag0.7Cu0.1RE Composite Solder/Cu Soldering Joint During Thermal Migration

作　　者：李世杰 张柯柯[1,2] 张超[1] 李俊恒 吴婉 LI Shijie;ZHANG Keke;ZHANG Chao;LI Junheng;WU Wan(Materials Science&Engineering School,Henan University of Science&Technology,Luoyang 471023,China;Collaborative Innovation Center of Non-ferrous Metals&Processing Technology,Henan University of Science&Technology,Luoyang 471023,China)

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471023 [2]河南科技大学有色金属共性技术河南省协同创新中心,河南洛阳471023

出　　处：《河南科技大学学报（自然科学版）》2022年第2期1-6,M0002,共7页Journal of Henan University of Science And Technology:Natural Science

基　　金：国家自然科学基金项目(U1604132);河南省杰出科技人才创新基金项目(154200510022)。

摘　　要：针对微焊点服役过程中由大温度梯度导致的热迁移问题,设计了一种热迁移试验装置,研究了复合钎料/Cu钎焊接头热迁移过程中的组织演变与力学性能。研究结果表明:设计的试验装置可满足单一热迁移试验条件。与未热加载时相比,Ni-GNSs增强Sn2.5Ag0.7Cu0.1RE复合钎料/Cu钎焊接头热迁移200 h后,接头热端Cu;Sn;界面金属间化合物(IMC)大幅减薄并在界面出现微孔洞;冷端界面粗大扇贝状IMC厚度明显增加,冷端Cu/Cu;Sn;界面间生成平均厚度1μm的层状IMC Cu;Sn;。热加载200 h后,钎焊接头剪切强度降低33%。复合钎料钎焊接头断裂位置由热端界面IMC/钎缝的过渡区向界面IMC方向迁移;随热加载时间增加其断裂机制由韧性断裂向先转变为以韧性断裂为主的韧-脆混合断裂,再转变为以脆性断裂为主的韧-脆混合断裂。Ni-GNSs增强相的添加可抑制复合钎料/Cu钎焊接头的热迁移。In order to solve the thermal migration problem caused by the large temperature gradient during the service of micro solder joints,a thermal migration test device was designed to study the microstructure evolution and mechanical properties of the composite solder/Cu soldering joint during thermal migration.The results show that the designed test device can meet the single thermal migration test condition.Compared with the non-thermal loading,after 200 h of Ni-GNSs reinforced Sn2.5Ag0.7Cu0.1RE composite solder/Cu soldering joint thermal migration,the hot end of the joint Cu;Sn;intermetallic compound (IMC) is greatly reduced and microvoids appeare at the interface.The thickness of the thick scallop-shaped IMC at the cold end interface is increased significantly,and the layered IMC Cu;Sn with an average thickness of 1μm is formed between the cold end Cu/Cu6Sn5 interface.The shear strength of solder joints is decreased by 33%after 200 h of heat loading.The fracture position of composite brazing joints migrates from the transition zone of the hot end interface IMC/soldering seam to the interface IMC.The fracture mechanism changes from ductile fracture to ductile fracture dominated by ductile-brittle mixed fracture,then with increasing in heat loading time,transforms into ductile-brittle mixed fracture dominated by brittle fracture.The addition of NiGNSs reinforcing phase can inhibit the thermal migration of composite solder/Cu soldering joints.

关 键 词：Sn2.5Ag0.7Cu0.1RE 镀Ni石墨烯纳米片 钎焊 热迁移 界面金属间化合物 力学性能 

分 类 号：TG454[金属学及工艺—焊接]