基于COMSOL的磁控溅射靶磁场的优化仿真  

Optimization Simulation of Magnetron Sputtering Target Magnetic Field Based on COMSOL

作　　者：刘壮[1] 迟晨阳 郭帆 许晓伟 LIU Zhuang;CHI Chen-yang;GUO Fan;XU Xiao-wei(College of Light Industry,Harbin University of Commerce,Harbin 150028,China)

机构地区：[1]哈尔滨商业大学轻工学院,哈尔滨150028

出　　处：《数字印刷》2021年第6期89-96,共8页Digital Printing

摘　　要：磁控溅射靶磁场的优化一直是磁控溅射的关键性问题,靶磁场的优化可有效提高靶材利用率,从而降低工业镀膜成本。本研究利用磁轭的磁化作用,通过磁轭结构形状的设计,使磁轭产生更多的磁极,与磁铁形成更多的环形磁路,增加刻蚀环,提高靶材利用率。仿真计算结果表明,该设计产生了两组环形磁路,优于普通靶磁场。通过优化磁场参数,得到最佳的靶磁场分布。利用COMSOL实现等离子与磁场耦合计算,得到电子分布与氩离子能量分布,与无磁场和普通靶磁场情况相比,本研究设计的磁控溅射等离子放电过程中的电子密度及氩离子能量均有大幅提高。The optimization of magnetron sputtering target magnetic field is always a key problem in magnetron sputtering, which can effectively improve the utilization rate of target material and reduce the cost of industrial coating. In this paper, the design of magnetic yoke structure shape can generate additional magnetic poles, form more annular magnetic paths with the magnet, and increase the etching ring and improve the utilization rate of the target material. Through the simulation calculation, the results showed that the design can generate two groups of annular magnetic paths, which is better than the common target magnetic field. By optimizing the magnetic field parameters,the optimal distribution of the target magnetic field is obtained. COMSOL is used to calculate the coupling of plasma and magnetic field, the electron distribution and argon ion energy distribution. Compared with the situation without magnetic field and common target magnetic field, the electron density and argon ion energy in the process of magnetron sputtering plasma discharge in this design are greatly improved.

关 键 词：磁控溅射 靶磁场 靶材利用率 

分 类 号：TB383.2[一般工业技术—材料科学与工程]