微纳系统微区感应加热技术的研究进展  

Research Progresses of Micro-area Induction Heating Technology in Micro/Nano Systems

作　　者：吴德志[1] 陈卓 海振银 陈亮 叶坤 王凌云[1] 赵立波[3] WU Dezhi;CHEN Zhuo;HAI Zhenyin;CHEN Liang;YE Kun;WANG Lingyun;ZHAO Libo(Department of Mechanical and Electrical Engineering,Xiamen University,Xiamen,Fujian,361005;Aviation Key Laboratory of Science and Technology on Inertial Technology,FACRI,Xi'an,710065;School of Mechanical Engineering,Xi'an Jiaotong University,Xi'an,710049)

机构地区：[1]厦门大学机电工程系,厦门361005 [2]航空工业自控所惯性技术航空科技重点实验室,西安710065 [3]西安交通大学机械工程学院,西安710049

出　　处：《中国机械工程》2022年第1期2-14,23,共14页China Mechanical Engineering

基　　金：国家自然科学基金(52075464,91648114);航空科学基金(20180868002)。

摘　　要：微区感应加热作为一种局部加热技术,兼具热响应快、非接触及加热特性可控等优势,在微机电系统、微流控芯片等微纳系统领域的应用潜力巨大。介绍了微区感应加热的基本原理,系统阐述了微区感应加热在封装、驱动及材料生长等方向的研究进展,分析了待解决的关键问题,总结并指出了发展方向。Micro-area induction heating(MIH),as a localized heating technique with characteristics of non-contact,controllable,and fast thermal-response,was shown numerous potentials in microsystems,such as microelectromechanical systems and microfluidic chips.The fundamentals of MIH were introduced herein,and the research progresses of MIH in the fields of packaging,driving,material growth,et al,was presented systematically.Furthermore,some existing technique problems needed to be solved were analyzed,and several prospective research directions of MIH were pointed out.

关 键 词：感应加热 局部加热 微系统 封装 

分 类 号：TH165[机械工程—机械制造及自动化]