含磷环氧树脂及其在无卤覆铜板中的应用进展  

Progress in phosphorus-containing epoxy resin and its application in halogen-free Copper Clad Laminate

作　　者：胡鹏 黄成 邢燕侠 王红海 唐海波 Hu Peng;Huang Cheng;Xing Yanxia;Wang Honghai;Tang Haibo(Jiangxi Shengyi Technology Co.,LTD.Jiujiang 332100,China)

机构地区：[1]江西生益科技有限公司,江西九江332100

出　　处：《印制电路信息》2022年第1期13-18,共6页Printed Circuit Information

摘　　要：文章重点综述了含磷环氧树脂和反应型含磷阻燃剂的合成与研究进展,介绍了含磷环氧固化体系在无卤覆铜板中的应用现状,进一步展望了5G浪潮下无卤覆铜板用含磷环氧树脂的发展方向。In this paper,the synthesis and research progress of phosphorus-containing epoxy resin and reactive phosphorus-containing flame retardant were reviewed.The application status of phosphorus-containing epoxy curing system in halogen-free Copper Cad Laminate was introduced,and the development direction of phosphorus-containing epoxy resin for halogen-free Copper Clad Laminate under 5G wave was further prospected.

关 键 词：无卤 磷系 环氧树脂 覆铜板 

分 类 号：TN41[电子电信—微电子学与固体电子学]