不溶性阳极应用于VCP整板电镀线的可行性研究  

Feasibility research on insoluble anode application to vertical continuous plating line

作　　者：付艺 Fu Yi(Zhuhai Founder Tech.Multilayer PCB Co.,Ltd,F7,Guangdong,Zhuhai,519175)

机构地区：[1]珠海方正科技多层电路板有限公司-F7,广东珠海519175

出　　处：《印制电路信息》2022年第1期36-40,共5页Printed Circuit Information

摘　　要：越来越多的高线速的垂直连续电镀(VCP)生产线被应用于通孔电镀流程以提高生产效率,这使得电镀线的阳极维护问题日益突出。为了解决阳极维护保养问题,不溶性阳极开始应用于常规通孔VCP电镀线以替代传统的磷铜阳极。本文基于理论数据分析和不溶性阳极VCP生产实践,论证了不溶性阳极应用于通孔VCP电镀线的可行性,总结其优点,并分析其发展前景。There are more and more high speed vertical continuous plating lines applied to through-hole panel plating process in order to enhance productivity,which leads to anode maintenance problem of plating line standing out day by day.In order to solve anode maintenance problem,the insoluble anode is beginning applied to common through-hole VCP lines.This article is based on theory data analysis and production practice of insoluble anode VCP line to demonstrate the feasible condition of insoluble anode VCP line applying to panel plating process,summarizes its advantages and predicts its development prospect.

关 键 词：垂直连续电镀 不溶性阳极 印制电路板 电镀线 可行性 

分 类 号：TN41[电子电信—微电子学与固体电子学]