基于梅花形点胶的表面安装元件粘接工艺改进  

Plum-Blossom Dispensing for Bonding Process of Small Package Components

作　　者：吉美宁 常明超 JI Meining;CHANG Mingchao(China Aerospace Components Engineering Center,Beijing 100094,China)

机构地区：[1]中国空间技术研究院,北京100094

出　　处：《电子与封装》2022年第1期23-26,共4页Electronics & Packaging

摘　　要：高可靠混合电路与微系统器件中,表面安装元件的粘接工艺改进与优化一直是备受关注的重点。提出了一种梅花形的自动化点胶工艺,试验数据表明,通过改进点胶方式,优化粘接胶形貌,表面安装元件的粘接强度提高50%以上,粘接工艺的一致性得到了有效提升。该方法同时解决了表面安装元件的粘接位置偏差、端头包裹率不足等多方面问题,可推广至混合集成电路、MCM、SiP等器件内部表面安装元件的粘接工序中,对高可靠器件的封装改进具有重要的参考意义。In highly reliable hybrid circuits and microsystem devices,the improvement and optimization of bonding process for surface mount components has been the focus of attention.Plum blossom shape automatic dispensing process is proposed.The test data shows that by improving the dispensing method and optimizing the adhesive morphology,the bonding strength of surface mounted components is increased by more than 50%,and the consistency of the bonding process is effectively improved.This method solves many problems such as the bonding position deviation,the insufficient end wrapping rate of surface mount components.It can be extended to the bonding process of internal surface mounted components of hybrid integrated circuits,MCM,SiP and other devices,and has reference value for the packaging and improvement of high-reliability devices.

关 键 词：梅花形 表面安装元件 点胶方式 粘接工艺 高可靠 剪切强度 工艺一致性 

分 类 号：TN305.94[电子电信—物理电子学]