微波组件裸芯片开裂的机理分析  

Analysis of Cracking Mechanism of Microwave Module Bare Chip

作　　者：李庆 LI Qing(Sichuang Electronics Co.,Ltd.,Hefei 230088,China)

机构地区：[1]四创电子股份有限公司,合肥230088

出　　处：《电子与封装》2022年第1期31-34,共4页Electronics & Packaging

摘　　要：针对微波组件壳体内部裸芯片出现不同程度裂纹的现象,从微波组件的工艺材料、工装设计、装配工艺过程、试验过程等逐一进行机理分析,找出了微波组件内部裸芯片开裂的真正原因。并提出了类似于该微波组件的结构在试验安装方面的控制要点。There are different degrees of cracks in the bare chip inside the shell of the microwave component.The mechanisms of the process materials,tooling design,assembly process and test process of the microwave module are analyzed one by one,and the real reason for the cracking of the bare chip inside the microwave module is found out.The structure similar to the microwave module and the control points in the test and installation are put forward.

关 键 词：工装 筛选试验 热膨胀系数 

分 类 号：TN454[电子电信—微电子学与固体电子学]