功率器件芯片互连用低温烧结铜基电子浆料研究进展  

Progress of copper-based paste as low-temperature sintering die attachment materials for power electronic devices

作　　者：徐恒一 徐红艳[2] 臧丽坤[1] 徐菊[2,3] XU Hengyi;XU Hongyan;ZANG Likun;XU Ju(School of Chemistry and Biological Engineering,University of Science and Technology Beijing,Beijing 100083,China;Institute of Electrical Engineering,Chinese Academy of Sciences,Beijing 100190,China;University of Chinese Academy of Sciences,Beijing 100049,China)

机构地区：[1]北京科技大学化学与生物工程学院,北京100083 [2]中国科学院电工研究所,北京100190 [3]中国科学院大学,北京100049

出　　处：《电子元件与材料》2022年第1期9-18,共10页Electronic Components And Materials

摘　　要：随着电力电子器件向着更高功率密度、更小体积和更高集成度等方向发展,特别是第三代半导体SiC和GaN功率芯片的应用,研究满足高功率密度、高工作电压、耐高温的功率器件封装用互连材料成为近年来的重要课题,开发低温连接、高温服役的高可靠性无铅互连材料具有重要意义。低温烧结铜基浆料具有价格低廉、导电导热性能好、抗电迁移等优点,是新型功率器件封装互连中理想的连接材料之一。通过结合纳米银和纳米铜浆料的优点能够获得连接稳定、烧结和服役性能可靠的铜基接头。概述了包括纳米铜银混合浆料、纳米铜银合金浆料以及银包铜复合浆料等铜基浆料的常见制备技术,阐释了各种浆料的烧结机理和接头性能,并对高性能铜基浆料的应用前景进行了展望。With the development of power devices and the application of third-generation semiconductor materials(SiC and GaN),the electronics device tends to be high power density,high operating voltage and high operating temperature.As a result,novel die attachment materials become a topic of focus,which has low bonding or sintering temperature and high service-temperature.Novel copper-based paste is one of the ideal die attachment materials due to its low price,excellent thermal,electrical and mechanical performance.It includes Cu-Ag hybrid nanoparticles paste,Cu-Ag nanoalloy paste,and Cu@Ag composite paste.The high-stable and reliable copper-based joint should be achieved for the application of power electronics devices.This review summarizes the current progress of the copper-based pastes,discusses its sintering mechanism,analyzes the performance of the copper-based joints,and gives prospect for copper-based pastes research in the future.

关 键 词：低温烧结 电子封装 综述 无铅互连 铜基浆料 接头性能 

分 类 号：TG454[金属学及工艺—焊接]