利用TRIZ创新方法提高BGA芯片贴装精度  

The application of TRIZ and its tool in improving BGA chip mounting accuracy

作　　者：程虎 Cheng Hu(WuHan Digital Engineering Institute,Wuhan430205,China)

机构地区：[1]武汉数字工程研究所,武汉430205

出　　处：《船电技术》2022年第2期55-60,共6页Marine Electric & Electronic Engineering

摘　　要：本文利用TRIZ创新方法提高BGA芯片贴装精度。运用TRIZ工具产生9个概念方案,针对解决方案进行分析、评估,最终确定了一种组合解,提高了BGA芯片贴装精度。In this paper,the TRIZ innovative method is used to solve the BGA chip mount precision problem.Nine scenarios are produced by using TRIZTOOL.According to the analyses and evaluations of the solutions,a combination solution is finally determined,which can improves the BGA chip mounting precision.

关 键 词：TRIZ BGA 贴装精度 

分 类 号：TM612[电气工程—电力系统及自动化]