基于玻璃衬底的三维电感器件的仿真与实现  

Simulation and Fabrication of 3D Inductors Based on Glass Substrate

作　　者：王磊 惠科晴 薛恺 姜峰 于大全 WANG Lei;HUI Keqing;XUE Kai;JIANG Feng;YU Daquan(Jiangsu Key Laboratory of ASIC Design(Wuxi),Wuxi,Jiangsu,214153,CHN;GMC Semitech Co.,Ltd,Wuxi,Jiangsu,214104,CHN;Xiamen Sky Semiconductor Technology Co.,Ltd,Xiamen,Fujian,361028,CHN)

机构地区：[1]江苏省专用集成电路设计重点实验室(无锡),江苏无锡214153 [2]吉姆西半导体科技(无锡)有限公司,江苏无锡214104 [3]厦门云天半导体科技有限公司,福建厦门361028

出　　处：《固体电子学研究与进展》2021年第6期419-424,共6页Research & Progress of SSE

基　　金：国家自然科学基金资助项目(61974121);江苏省专用集成电路设计重点实验室开放课题资助项目(2020KL0P011);江苏信息职业技术学院人才启动经费资助项目[10072020028(006)]。

摘　　要：为了实现射频电子系统中对高品质因数电感的迫切需求,首先基于玻璃衬底建立了三维电感的电磁仿真模型,并从槽深度、线宽、线间距、电感线圈内径和匝数等方面对电感的电感值及其品质因数Q进行了参数化的仿真研究。仿真结果表明,玻璃衬底上三维电感的最优参数组合为槽深度120~150μm、线宽30~40μm、线间距30~60μm、电感线圈内径250μm和1.5~3圈的电感匝数。在光敏玻璃衬底上利用玻璃通孔技术进行三维电感的制作并对完成的电感进行了测试。电感测得的最大Q值均大于55,该测试结果与仿真结果相一致,验证了三维电感仿真模型的有效性和制造工艺的可实施性。In order to realize the demand for high quality factor inductors in the RF system,the simulation models of three-dimension inductors were established on glass substrate,then parametric simulations were done from the aspects of width,trench thickness,spacing,diameter and turns.The simulation results show that the optimal parameter combination of the inductor on glass substrate is 120~150μm trench depth,30~40μm trench width,30~60μm trench spacing,250μm inner diame⁃ter,and 1.5~3 turns.Then the 3D inductors were fabricated using through glass via technique on the photosensitive glass substrate and measured.The peak Q factors are higher than 55,which is consis⁃tent with the simulation results.The effectiveness of the simulation model and the feasibility of manu⁃facturing processes are verified.

关 键 词：集成电感 玻璃槽电感 玻璃通孔 光敏玻璃 深槽填充 

分 类 号：TN402[电子电信—微电子学与固体电子学]