氟化钡晶体超精密切削材料去除机理研究  

Investigations on the Material Removal Mechanism of BaF_(2) Crystal via Ultra-precision Diamond Turning

作　　者：康杰 王元康 张万清 杨伟声 魏齐 邹俊东 刘亚飞 Kang Jie;Wang Yuankang;Zhang Wanqing;Yang Weisheng;Wei Qi;Zou Jundong;Liu Yafei

机构地区：[1]云南北方光学科技有限公司,昆明市650200

出　　处：《工具技术》2022年第1期73-77,共5页Tool Engineering

摘　　要：氟化钡晶体在红外成像与激光系统有着广泛而重要的应用,作为典型的萤石型离子晶体,其材料去除机理目前尚不清晰,获得超光滑表面仍极具挑战。本研究采用槽切法研究氟化钡晶体脆塑转变临界深度、脆塑转变机制及表面缺陷形成机理。通过分析最大未变形切屑厚度随切削参数的变化规律,提出实现氟化钡晶体塑性域切削的理论模型。对氟化钡晶体进行了端面车削,并借助场发射扫描电子显微镜和轮廓仪对表面微观形貌和表面粗糙度进行了检测。研究表明,在进给率为0.5μm/r,切削深度为5μm的条件下,氟化钡晶体能够在塑性切削模式下实现材料去除,并成功加工出粗糙度Ra值为2.76nm的光滑表面。BaF_(2)crystal has been widely used in infrared imaging and laser systems.As a typical fluorite type ionic crystal,its material removal mechanism is still unclear,and it is still a great challenge to obtain smooth surface.In this study,the brittle plasfic transition depth,mechanism and surface defect formation of BaF_(2)crystal are studied by grooving method.By analyzing the variation of maximum undeformed chip thickness with cutting parameters,a theoretical model for realizing BaF_(2)crystal plastic cutting is proposed.The surface morphology and surface roughness of BaF_(2)crystal are measured by field emission scanning electron microscope and profilometer.The results show that BaF_(2)crystal can achieve material removal in plastic cutting mode under the condition of feed rate of 0.5μm/r and cutting depth of 5μm,and the smooth surface with Ra 2.76nm is successfully machined.

关 键 词：氟化钡晶体 脆塑转变 最大未变形切屑厚度 切削参数 塑性域切削 

分 类 号：TG115[金属学及工艺—物理冶金] TG61[金属学及工艺—金属学]