利用原子层沉积技术制备柔性超高阻隔膜研究进展  

Research Progress of Ultra-High Barrier Thin Films Fabricated by Atomic Layer Deposition on Flexible Polymeric Materials

作　　者：陈兰兰 孙小杰 任月庆 王荣 CHEN Lanlan;SUN Xiaojie;REN Yueqing;WANG Rong(National Institute of Clean-and-Low-Carbon Energy,Beijing 102211,China)

机构地区：[1]北京低碳清洁能源研究院北京市昌平区未来科学城,北京102211

出　　处：《真空科学与技术学报》2021年第12期1117-1124,共8页Chinese Journal of Vacuum Science and Technology

基　　金：国家重点研发计划(2018YFB1500200)。

摘　　要：在柔性产业的引领下,柔性超高阻隔膜由于可以使器件免受水汽侵蚀,延长使用寿命,广泛应用于有机发光二极管(OLED)柔性面板、量子点显示、柔性光伏等行业。原子层沉积(ALD)技术是一种原子尺度的薄膜制备技术,沉积的薄膜均匀性好、纯度高、而且厚度精确可控,是超高阻隔膜的理想制备方法。本文总结了ALD的基本原理,技术特点和沉积条件等。重点阐述了ALD技术制备单层、多层无机阻隔薄膜,以及有机/无机叠层阻隔薄膜的国内外研究进展及阻隔机理。同时提出有机/无机叠层结构是实现阻隔膜超低水汽透过率的有效手段。最后指出了原子层沉积技术制备柔性超高阻隔膜的未来发展趋势。Ultra-high barrier film,which can protect the organic electronic device from water vapor erosion and prolong its lifetime,is widely used in flexible OLED panels,quantum dot display and flexible photovoltaic.Atomic layer deposition(ALD)is an ideal preparation method for ultra-high barrier film on the atomic scale,affording the film with good uniformity,high purity,and precisely controlled thickness.In this paper,the basic principle,technical characteristics,and deposition conditions of ALD are reviewed.The research progresses of singlelayer and multi-layer inorganic barrier films,as well as organic/inorganic laminated barrier films prepared by ALD technology are emphasized.In addition,it is indicated that the organic/inorganic laminated structure is considered an effective method to achieve ultra-low water vapor transmittance rate(WVTR)of barrier film.Finally,the future development trend of the preparation of flexible ultra-high barrier films by ALD is prospected.

关 键 词：高阻隔膜 柔性 原子层沉积 水汽透过率 

分 类 号：TB43[一般工业技术]