孔内凹蚀工艺对芯吸效应的影响分析  

Impact analysis of positive etch back process on wicking

作　　者：黄光明 Huang Guangming(MFS Technology(PCB)Co.,Ltd.)

机构地区：[1]湖南维胜科技电路板有限公司,湖南长沙410100

出　　处：《印制电路信息》2022年第2期33-38,共6页Printed Circuit Information

摘　　要：高可靠性要求的印制电路板,常要求进行孔内凹蚀以实现孔壁铜对内层铜具有三面包夹的效果增加互联可靠性。本文以实现凹蚀工艺的三个主要步骤:等离子、化学除胶和玻纤蚀刻对芯吸的影响研究为基础,通过SEM、微切片观察各流程后孔壁的微观形貌变化以及PTH后孔铜结构变化,分析了玻纤束及其周边树脂的变化与芯吸长度的关系,确定了各流程对芯吸长度的影响程度,相应地提出了改善芯吸效应的方法,为凹蚀工艺控制芯吸长度提供了有效的指导。In part of the military and aerospace PCB with high reliability requirements,it is required to etch back to increase reliability for the structure of three breads.This paper made research on the effect of three main processes of etch back:plasma,desmear and glass fiber etching on wicking as the basis.Through observing morphology on the hole wall and copper structure of PTH changing after each process by the SEM and microsection,the relationships between glass fiber bundles and surrounding resin cracking changes with wicking was analyzed.The influence of each process on the wicking length was determined.Accordingly,the method to improve the wicking effect was proposed,which provided an effective guidance for controlling the wicking length in the etch back process.

关 键 词：凹蚀 芯吸 等离子 化学除钻污 玻纤蚀刻 

分 类 号：TN41[电子电信—微电子学与固体电子学]